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Two typical layered ternary compounds. Ti(3)SiC(2) and Ti(3)AlC(2), were joined directly by solid-state diffusion bonding method. By various bonding tests at 1100-1300 degrees C for 30-120 min under 10-30 MPa, and characterizing the microstructure and diffusion reactive phases of the joints by scanning electron microscopy (SEM). energy dispersive X-ray spectrometer (EDS), transmission electron microscopy (TEM) and X-ray diffraction (XRD). the optimal condition for direct joining of Ti(3)SiC(2) and Ti(3)AlC(2) was obtained. Strong joints of Ti(3)SiC(2)/Ti(3)AlC(2) can be achieved via diffusion bonding, which is attributed to remarkable interdiffusion of Si and Al at the joint interface. The shear strength of the Ti(3)SiC(2)/Ti(3)AlC(2) joints was determined. (C) 2008 Elsevier Ltd. All rights reserved.