材料期刊网

To obtain qualified electroless Ni-P coating on W-Cu composite, the influences of three different activation processes, chemical activation, chemical activation and strike nickel plating, and anodic activation and strike nickel plating, on the adhesion of electroless Ni-P coating to W-Cu composite have been studied in this paper. The adhesion between the Ni-P coating and the W Cu composite has been estimated by scratch, file and bend tests. The results indicate that the samples, pretreated by anodic activation and strike nickel plating, have the qualified adhesion. The samples that pretreated by chemical activation and chemical activation and strike nickel plating do not have the qualified adhesion. SEM shows that the surface morphology of Ni-P coating is smooth, no hemispherical clusters appeared and XRD indicates that it has an amorphous structure.