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A Ti4+-doped nano-structured AgSnO2 material was prepared using sol-gel method and characterized by X-ray diffraction (XRD), transmis-sion electron microscopy (TEM), and scanning electron microscopy (SEM). The results show that Ti4+ cations are successfully doped into the crystal lattice of SnO2, and thus significantly improve the electrical conductivity of the sample. Furthermore, the coating of Ag on Ti4+-doped SnO2 nano-sized particles enhances the surface wettability and enables the resulting AgSnO2 material to have better mechanical properties.

参考文献

[1] Yasuyoshi S;Hisaaki T;Toshihiko T;Tatsuhiko N,Kazumasa T,Takahiko H,Toshiatsu N,Masaya N .Lead-free piezoelectrics[J].NATURE,2004,432:84.
[2] Leung C;Eric S;Dennis F.Weibull analysis of switching contact resistance in laboratory and commercial circuit breakers[A].Pittsburgh,PA,USA,2007:56.
[3] Choi W J .Reliability of Pb-free Solders in Electronic Packaging Technology[D].University of California,Los Angeles,2002.
[4] Liu L B;Cristina A;Johan L .Thermodynamic assessment of the Sn-Co lead-free solder system[J].Journal of Electronic Materials,2004,33:935.
[5] Liu Y;Li Z Y;Li J H .IrO2/SnO2 electrodes:prepared by sol-gel process and their electrocatalytic for pyrocatechol[J].Acta Materials,2004,52:721.
[6] Lopez-Navarrete E;Caballero A;Orera V M;Lazaro F J,Ocana M .Oxidation state and localization of chromium ions in Cr-doped cassiterite and Cr-doped malayaite[J].Acta Materials,2003,51:2372.
[7] Garima Jain;R. Kumar .Electrical and optical properties of tin oxide and antimony doped tin oxide films[J].Optical materials,2004(1):27-31.
[8] Miao H Y;Ding C S;Luo H J .Antimony-doped tin dioxide nanometer powders prepared by the hydrothermal method[J].Microelectronic Engineering,2003,66:142.
[9] Lee K M;Lee D J;Alan H .XRD and TEM studies on tin oxide (Ⅱ) nanoparticles prepared by inert gas condensation[J].Materials Letters,2004,58:3122.
[10] Ewa B .Wettability studies of cubic boron nitride by silver-titanium[J].Ceramics International,1995,21:303.
[11] Yu D Q;Zhao J;Wong L .Improvement on the microstructure stability,mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements[J].Journal of Alloys and Compounds,2004,376:170.
[12] Chang T C;Hsu Y T;Hon M H;Wang M C .Enhancement of the wettability and solder joint reliability at the Sn-9Zn-0 5Ag lead-free solder alloy-Cu interface by Ag precoating[J].Journal of Alloys and Compounds,2003,360:217.
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