Dissolutive wetting process and interfacial characteristic of molten Sn-17Bi-0.5Cu alloy on copper substrate

稀有金属（英文版）, 2013, 32(6): 537-543. doi: 10.1007/s12598-013-0167-1

^1, , ^2, , ^3, , ^4, , ^5,

1.Beijing Key Laboratory for Solid Waste Utilization and Management, Department of Energy and Resources Engineering,College of Engineering, Peking University, Beijing 100871,China

2.Department of Chemistry, School of Chemistry and Biology Engineering, University of Science and Technology Beijing,Beijing 100083, China

3.Beijing Key Laboratory for Solid Waste Utilization and Management, Department of Energy and Resources Engineering,College of Engineering, Peking University, Beijing 100871,China

4.Beijing Key Laboratory for Solid Waste Utilization and Management, Department of Energy and Resources Engineering,College of Engineering, Peking University, Beijing 100871,China

5.Beijing Key Laboratory for Solid Waste Utilization and Management, Department of Energy and Resources Engineering,College of Engineering, Peking University, Beijing 100871,China

基金项目: This study was financially supported by the National Natural Science Foundation of China (51174008)

Dissolutive wetting process and interfacial characteristic of molten Sn-17Bi-0.5Cu alloy on copper substrate

Bing-Sheng Xu ^1, , Li-Kun Zang ^2, , Zhang-Fu Yuan ^3, , Yan Wu ^4, , Zhou Zhou ^5,

1.Beijing Key Laboratory for Solid Waste Utilization and Management, Department of Energy and Resources Engineering,College of Engineering, Peking University, Beijing 100871,China

2.Department of Chemistry, School of Chemistry and Biology Engineering, University of Science and Technology Beijing,Beijing 100083, China

3.Beijing Key Laboratory for Solid Waste Utilization and Management, Department of Energy and Resources Engineering,College of Engineering, Peking University, Beijing 100871,China

4.Beijing Key Laboratory for Solid Waste Utilization and Management, Department of Energy and Resources Engineering,College of Engineering, Peking University, Beijing 100871,China

5.Beijing Key Laboratory for Solid Waste Utilization and Management, Department of Energy and Resources Engineering,College of Engineering, Peking University, Beijing 100871,China

Keywords： Lead-free solder

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