Wettability balance method was used to investigate the wetting performance of SnCuNi-xEu on Cu substrate, and the me-chanical properties and the fracture morphology were studied. The results indicated that the addition of Eu could enhance the properties of solder and solder joints, with the increase of Eu content, tendency of first increase and then decrease could be found in the wetting time, wetting force and the mechanical properties of SnCuNi-xEu, and the optimal content was 0.039%. For SnCuNi-0.039Eu solder joints, the optimum mechanical properties could be found, and the amplitude increased was 20%, with the observation of the fracture morphology, it was found that small dimples could be seen, the toughness fracture for SnCuNi and mixture fracture for SnCuNi-0.039Eu could be demonstrated. And thermal fatigue behavior of SnCuNi solder joints could be enhanced obviously with the 0.039%Eu addition.
参考文献
| [1] | Yen Y W;Hsieh Y P;Jao C C;Chiu C W Li Y S .Interfa-cial reaction of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn lead-free solders with Fe-42Ni substrates[J].J Electron Mater,2014,43(01):187. |
| [2] | Billah M M;Shorowordi K M;Sharif A .Effect of micro size Ni particle addition in Sn-8Zn-3Bi lead-free solder al-loy on the microstructure, thermal and mechanical proper-ties[J].J Alloys Compd,2014,585:32. |
| [3] | Zhang, L.;Han, J.-G.;Guo, Y.-H.;He, C.-W. .Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging[J].IEEE Transactions on Electron Devices,2012(12):3269-3272. |
| [4] | Wang J X .Study on effects of Ce on properties of Sn-Ag-Cu &Sn-Cu-Ni solders and reliability of soldered joints[D].Nanjing University of Aeronautics and Astronautics,2009. |
| [5] | Kazuhiro Nogita .Stabilisation of Cu_6Sn_5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys[J].Intermetallics,2010(1):145-149. |
| [6] | 王俭辛,薛松柏,韩宗杰,史益平,张亮.稀土Ce对Sn-Cu-Ni钎料物理性能和铺展性能的影响[J].电焊机,2008(09):42-45. |
| [7] | Zhang L;Xue S B;Gao L L;Zeng G Sheng Z Chen Y Yu S L .Effects of rare earths on properties and micro-structures of lead-free solder alloys[J].J Mater Sci -Mater Electron,2009,20:685. |
| [8] | Zhang L;Han J G;Guo Y H;He C W .Properties en-hancement of SnAgCu solders containing rare earth Yb[J].Mater Des,2014,57:646. |
| [9] | Zhang L;Han J G;Guo Y H;He C W .Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments[J].Mater Sci Eng A,2014,597:219. |
| [10] | Wang J X;Xue S B;Han Z J;Yu S L Chen Y Shi Y P Wang H .Effects of rare earth Ce on microstructures, sol-derability of Sn-Ag-Cu and Sn-Cu-Ni solders as well as mechanical properties of soldered joints[J].J Alloys Compd,2009,467(1-2):219. |
| [11] | Luo J D .Study on the microstructure, properties and joint reliability of SnCuNi-xPr lead-free solder[D].Nanjing Uni-versity of Aeronautics and Astronautics,2013. |
| [12] | Hu Y H;Xue S B;Wang H;Ye H Xiao Z X Gao L L .Effects of rare earth element Nd on the solderability and microstructure of Sn-Zn lead-free solder[J].J Mater Sci-Mater Electron,2011,22:481. |
| [13] | L. Wang;D.Q. Yu;J. Zhao .Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy[J].Materials Letters,2002(6):1039-1042. |
| [14] | ZHANG Liang,CUI Junhua,HAN Jiguang,GUO Yonghuan,HE Chengwen.Microstructures and properties of SnZn-xEr lead-free solders[J].稀土学报（英文版）,2012(08):790-793. |
| [15] | Yoon J W;Noh B I;Kim B K;Shur C C Jung S B .Wet-tability and interfacial reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu solder joints[J].J Alloys Compd,2009,486(1-2):142. |
| [16] | Alongheng Baated;Keun-Soo Kim;Katsuaki Suganuma;Sharon Huang;Benjamin Jurcik;Shigeyoshi Nozawa;Minoru Ueshima .Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders[J].Journal of Materials Science. Materials in Electronics,2010(10):1066-1075. |
| [17] | Liang Zhang;Song-bai Xue;Li-li Gao;Zhong Sheng;Huan Ye;Zheng-xiang Xiao;Guang Zeng;Yan Chen;Sheng-lin Yu .Development of Sn-Zn lead-free solders bearing alloying elements[J].Journal of Materials Science. Materials in Electronics,2010(1):1-15. |
| [18] | L. Zhang;J.-G. Han;Y.-H. Guo .Properties of SnZn lead free solders bearing rare earth Y[J].Science and Technology of Welding and Joining,2012(5):424-428. |
| [19] | Ma X;Qian Y Y;Yoshida F .Effect of La on the Cu-Sn intermetallic compound(IMC)growth and solder joint re-liability[J].J Alloys Compd,2002,334(1-2):224. |
| [20] | Han Z J;Xue S B;Wang J X;Zhang X Zhang L Yu S L Wang H .Mechanical properties of QFP micro-joints sol-dered with lead-free solders using didode laser soldering technology[J].Trans Nonferrous Met Soc China,2008,18(04):814. |
| [21] | Dhafer Abdulameer Shnawah;Mohd Faizul Mohd Sabri;Irfan Anjum Badruddin .A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products[J].Microelectronics and reliability,2012(1):90-99. |
| [22] | Zhang L;Han J G;He C W;Guo Y H .Reliability behavior of lead-free soldered joints in electronic components[J].J Mater Sci -Mater Electron,2013,24(01):172. |
| [23] | Zhang L;Han J G;Guo Y H;Sun L .Properties and micro-structures of SnAgCu-xEu alloys for concentrator silicon solar cells solder layer[J].Sol Energy Mater Sol Cells,2014,130:397. |
| [24] | Zhang L;Tu K N .Structure and properties of lead-free sol-ders bearing micro and nano particles[J].Mater Sci Eng R,2014,82:1. |
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