研究了金属间化合物厚度对蜂窝状棒材热性能和力学性能的影响。在200°C下采用重复静液挤压制备Al/Cu蜂窝状棒材。在制备过程中,Al/Cu界面生成1μm厚的金属间化合物层。经420°C退火0.5~2 h后续热处理后,可获得不同厚度的金属间化合物层,最厚可达10.1μm。经鉴定,金属间化合物层为 Al2Cu(θ)、AlCu(η2)和Al4Cu9(γ1)相。随着金属间化合物层厚度的增加,纵向和截面方向上的热导率分别减小11.9%(从(268±4.8)到(236±4.4)W/(m·K))和10.4%(从(210±3.2)到(188±2.8)W/(m·K)),Al/Cu蜂窝状棒材的抗拉强度和伸长率分别是(103±8.4) MPa和(73±6.2)%。当金属间化合物层厚度达到7.7μm时,抗拉强度增加至(131±6.5) MPa,随着金属间化合物层厚度增加至10.1μm时,抗拉强度降低至(124±3.9) MPa。随着金属间化合物层厚度增加,蜂窝状棒材的伸长率急剧下降至(29±2.5)%。
The effect of intermetallic compound (IMC) thickness on the thermal and mechanical properties of Al/Cu honeycomb rods was investigated. The Al/Cu honeycomb rods were fabricated using repeated hydrostatic extrusions at 200 °C. During the process, an IMC layer with 1μm in thickness was generated at the Al/Cu interface. Different IMC thicknesses were obtained by post-heat treatment at 420 °C for 0.5 to 2 h. The IMC thickness increased to 10.1μm. The IMC layers were identified as Al2Cu (θ), AlCu (η2), and Al4Cu9(γ1) phases. The thermal conductivities in the longitudinal direction and cross direction decreased by 11.9% ((268±4.8) to (236±4.4) W/(m·K)) and 10.4% ((210±3.2) to (188±2.8) W/(m·K)), respectively, with increasing IMC thickness. The ultimate tensile strength and elongation of the Al/Cu honeycomb rod are (103±8.4) MPa and (73±6.2)%, respectively. The ultimate tensile strength increased to (131±6.5) MPa until the IMC thickness reached 7.7μm. It subsequently decreased to (124±3.9) MPa until the IMC thickness reached 10.1μm. The elongation of the Al/Cu honeycomb rod then sharply decreased to (29±2.5)% with increasing IMC thickness.
参考文献
[1] | K.Y. Rhee;W.Y. Han;H.J. Park;S.S. Kim.Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,20041/2(1/2):70-76. |
[2] | Antoine Gueydan;Bernadette Domenges;Eric Hug.Study of the intermetallic growth in copper-clad aluminum wires after thermal aging[J].Intermetallics,2014:34-42. |
[3] | Guo Xunzhong;Tao Jie;Wang Wentao;Li Huaguan;Wang Chen.Effects of the inner mould material on the aluminium-316L stainless steel explosive clad pipe[J].Materials & design,2013Aug.(Aug.):116-122. |
[4] | Sasaki, T.T.;Barkey, M.;Thompson, G.B.;Syarif, Y.;Fox, D..Microstructural evolution of copper clad steel bimetallic wire[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,20116(6):2974-2981. |
[5] | J. Sun;W.P. Tong;L. Zuo;Z.B. Wang.Low-temperature plasma nitriding of titanium layer on Ti/Al clad sheet[J].Materials & design,2013May(May):408-415. |
[6] | T. Saeid;A. Abdollah-zadeh;B. Sazgari.Weldability and mechanical properties of dissimilar aluminum-copper lap joints made by friction stir welding[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20101/2(1/2):652-655. |
[7] | Xia CZ;Li YJ;Puchkov UA;Gerasimov SA;Wang J.Microstructure and phase constitution near the interface of Cu/Al vacuum brazing using Al-Si filler metal[J].Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology,20088(8):799-804. |
[8] | In-Kyu Kim;Sun Ig Hong.Effect of heat treatment on the bending behavior of tri-layered Cu/Al/Cu composite plates[J].Materials & design,2013May(May):590-598. |
[9] | Tortorici PC.;Dayananda MA..Phase formation and interdiffusion in Al-clad 430 stainless steels[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,19982(2):207-215. |
[10] | N. Venkateswara Rao;G. Madhusudhan Reddy;S. Nagarjuna.Weld overlay cladding of high strength low alloy steel with austenitic stainless steel - Structure and properties[J].Materials & design,20114(4):2496-2506. |
[11] | 孙显俊;陶杰;郭训忠.铁/铝爆炸复合双金属管界面的结合性能[J].中国有色金属学报(英文版),2011(10):2175-2180. |
[12] | LY. Sheng;F. Yang;T.F. Xi;C. Lai;H.Q, Ye.Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling[J].Composites, Part B. Engineering,20116(6):1468-1473. |
[13] | M. Abbasi;A. Karimi Taheri;M.T. Salehi.Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20011/2(1/2):233-241. |
[14] | Hug, E.;Bellido, N..Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,201122(22):7103-7106. |
[15] | Won-Bae Lee;Kuek-Saeng Bang;Seung-Boo Jung.Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20051/2(1/2):212-219. |
[16] | Lee, Tae-Hyuk;Lee, Young-Jun;Park, Kyung-Tae;Jeong, Ha-Guk;Lee, Jong-Hyeon.Mechanical and asymmetrical thermal properties of Al/Cu composite fabricated by repeated hydrostatic extrusion process[J].Metals and Materials International,20152(2):402-407. |
[17] | H.G. Jeong;D.J. Yoon;E.Z. Kim.The influence by hydrostatic extrusion on the microstructure and extrudability of the IM processed hypereutectic Al-Si-X alloys[J].Journal of Materials Processing Technology,20020(0):438-443. |
[18] | Chih-Yuan Chen;Weng-Sing Hwang.Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints[J].Materials transactions,20077(7):1938-1947. |
[19] | P. F. Thomason;G. Rauchs;P. J. Withers.Multi-scale finite-element modelling of fatigue-crack growth in TiAl intermetallic matrix TiNb and Nb platelet composites[J].Acta materialia,20026(6):1453-1466. |
[20] | A. Mozaffari;M. Hosseini;H. Danesh Manesh.Al/Ni metal intermetallic composite produced by accumulative roll bonding and reaction annealing[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,201141(41):9938-9945. |
- 下载量()
- 访问量()
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%