研究Sn?0.75Cu焊料合金及其接头在NaCl?Na2SO4和NaCl?Na2SO4?Na2CO3模拟土壤溶液中的腐蚀与浸出行为，并与其在NaCl溶液中的行为进行对比，以评估废弃电子产品被填埋时对环境的潜在危害。Sn的浸出动力学表明，Sn的浸出量随时间的增加而增加。在NaCl溶液中接头的Sn浸出量是最多的。2?4SO 和2?3CO 阻碍了接头中Sn的浸出，但加速了焊料中Sn的浸出。在NaCl溶液中的接头表面腐蚀层疏松多孔，而在NaCl?Na2SO4和 NaCl?Na2SO4?Na2CO3溶液中的接头表面腐蚀层则较为致密。XRD 结果表明，焊料和接头表面的腐蚀产物以Sn的氧化物、氯化物和碱式氯化物为主。讨论了焊料合金在模拟土壤溶液中的动电位极化曲线。
The corrosion and leaching behaviors of Sn?0.75Cu solders and joints in NaCl?Na2SO4 and NaCl?Na2SO4?Na2CO3 simulated soil solutions were investigated compared with those in NaCl solution, aiming to assess the potential risk from the electronic-waste disposed in soil. The leaching kinetics of Sn reveals that the leaching amount of Sn increases with increasing the time. The amount of Sn leached from the joint is the largest in NaCl solution.2?4SO and2?3CO inhibit the leaching of Sn from the joints, but accelerate that from the solders. Meanwhile, the corrosion layer of the joint in NaCl solution is more porous, and those immersed in NaCl?Na2SO4 and NaCl?Na2SO4?Na2CO3 solutions are compact. The XRD results indicate that the main corrosion products on the solders and joints surfaces are comprised of tin oxide, tin chloride and tin chloride hydroxide. The potentiodynamic polarization measurements for the solders were discussed in the simulated soil solutions.
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