采用化学镀法在纯铜基体上镀上镍?磷镀层，并通过液固复合铸造工艺制备 Al/Cu 双金属材料。研究不同工艺参数(结合温度、预热时间)下 Al/Cu 接头的显微组织、力学性能和导电性能。结果表明，各种金属间化合物在界面处形成，其厚度和种类随结合温度和预热时间的增加而增加。Ni?P 夹层发挥了扩散阻碍层和保护膜的作用，有效地减少了金属间化合物的形成。Al/Cu 双金属复合材料的剪切强度和电导率随金属间化合物厚度的增加而减小，特别地，Al2Cu 相的不利影响相比其他金属间化合物更加明显。在780°C 预热150 s 条件下制备的试样表现出最大的剪切强度和电导率，其值分别为49.8 MPa 和5.29×105 S/cm。
A Ni?P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid?liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters (bonding temperature and preheating time) were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni?P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 °C for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29×105 S/cm, respectively.
参考文献
| [1] | Mustafa Acarer.Electrical, Corrosion, and Mechanical Properties of Aluminum-Copper Joints Produced by Explosive Welding[J].Journal of Materials Engineering and Performance,201211(11):2375-2379. |
| [2] | Yu, Z;Duan, YP;Liu, LD;Liu, SH;Liu, XJ;Li, XG.Growth behavior of Cu/Al intermetallic compounds in hot-dip aluminized copper[J].Surface and Interface Analysis: SIA: An International Journal Devoted to the Development and Application of Techniques for the Analysis of Surfaces, Interfaces and Thin Films,20095(5):361-365. |
| [3] | 赵鸿金;王达;秦镜;张迎晖.铜/铝层状复合材料结合机理与界面反应研究进展[J].热加工工艺,2011(10):84-87. |
| [4] | T.T. Sasaki;R.A. Morris;G.B. Thompson;Y. Syarif;D. Fox.Formation of ultra-fine copper grains in copper-clad aluminum wire[J].Scripta materialia,20105(5):488-491. |
| [5] | Wang Juan;Li Yajiang;Liu Peng;Geng Haoran.Microstructure and XRD analysis in the interface zone of Mg/Al diffusion bonding[J].Journal of Materials Processing Technology,20081/3(1/3):146-150. |
| [6] | K.Y. Rhee;W.Y. Han;H.J. Park;S.S. Kim.Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,20041/2(1/2):70-76. |
| [7] | 赵佳蕾;接金川;陈飞;陈航;李廷举;曹志强.浸镀Ni对Al/Cu双金属材料界面显微组织及力学性能的影响[J].中国有色金属学报（英文版）,2014(6):1659-1665. |
| [8] | M. Abbasi;A. Karimi Taheri;M.T. Salehi.Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20011/2(1/2):233-241. |
| [9] | LY. Sheng;F. Yang;T.F. Xi;C. Lai;H.Q, Ye.Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling[J].Composites, Part B. Engineering,20116(6):1468-1473. |
| [10] | Guo, Y.;Liu, G.;Jin, H.;Shi, Z.;Qiao, G..Intermetallic phase formation in diffusion-bonded Cu/Al laminates[J].Journal of Materials Science,20118(8):2467-2473. |
| [11] | 姬峰;薛松柏;娄继源;娄银斌;王水庆.Zn-Al钎料钎焊Cu/Al接头组织和性能[J].中国有色金属学报（英文版）,2012(2):281-287. |
| [12] | Ji Feng;Xue Songbai;Dai Wei.Reliability studies of Cu/Al joints brazed with Zn-Al-Ce filler metals[J].Materials & design,2012Dec.(Dec.):156-163. |
| [13] | HENRYK PAUL;LIDIA LITYNSKA-DOBRZYNSKA;MARIUSZ PRAZMOWSKI.Microstructure and Phase Constitution Near the Interface of Explosively Welded Aluminum/Copper Plates[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,20138(8):3836-3851. |
| [14] | Behcet Gulenc.Investigation of interface properties and weldability of aluminum and copper plates by explosive welding method[J].Materials & Design,20081(1):275-278. |
| [15] | 张秋征;宫文彪;刘威.铝-铜异种金属搅拌摩擦焊接头组织及力学性能[J].中国有色金属学报（英文版）,2015(6):1779-1786. |
| [16] | Xue, P.;Ni, D.R.;Wang, D.;Xiao, B.L.;Ma, Z.Y..Effect of friction stir welding parameters on the microstructure and mechanical properties of the dissimilar Al-Cu joints[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,201113/14(13/14):4683-4689. |
| [17] | T. Saeid;A. Abdollah-zadeh;B. Sazgari.Weldability and mechanical properties of dissimilar aluminum-copper lap joints made by friction stir welding[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20101/2(1/2):652-655. |
| [18] | Konrad J.M.PAPIS;Joerg F.LOEFFLER;Peter J.UGGOWITZER.Light metal compound casting[J].中国科学E辑（英文版）,2009(1):46-51. |
| [19] | G. R. Zare;M. Divandari;H. Arabi.Investigation on interface of Al/Cu couples in compound casting[J].Materials Science and Technology: MST: A publication of the Institute of Metals,20132(2):190-196. |
| [20] | Hajjari, E.;Divandari, M.;Razavi, S.H.;Emami, S.M.;Homma, T.;Kamado, S..Dissimilar joining of Al/Mg light metals by compound casting process[J].Journal of Materials Science,201120(20):6491-6499. |
| [21] | Jian Zhang;Yuan Xiao;Guoqiang Luo;Qiang Shen;Lianmeng Zhang.Effect of Ni interlayer on strength and microstructure of diffusion-bonded Mo/Cu joints[J].Materials Letters,20121(1):113-116. |
| [22] | S. Kundu;S. Chatterjee.Characterization of diffusion bonded joint between titanium and 304 stainless steel using a Ni interlayer[J].Materials Characterization,20085(5):631-637. |
| [23] | Jian Zhang;Guoqiang Luo;Yiyu Wang.Effect of Al thin film and Ni foil interlayer on diffusion bonded Mg-Al dissimilar joints[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2013:139-142. |
| [24] | K.J. Dai;Y.Xiong;J. H.Yin.Electroless Ni-P coating on Cu substrate with strike nickel activation and its corrosion resistance[J].Materialwissenschaft und Werkstofftechnik,201311(11):918-921. |
| [25] | Ho, C. E.;Fan, C. W.;Hsieh, W. Z..Pronounced effects of Ni(P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive system[J].Surface & Coatings Technology,2014Pt.B(Pt.B):244-251. |
| [26] | Guangchen Xu;Alan A. Luo;Yiqing Chen;Anil K. Sachdev.Interfacial phenomena in magnesium/aluminum bi-metallic castings[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2014:154-158. |
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