用电镀方法在Fe、Ni和Ag基体上沉积Cu膜，在Fe和Ag基体上沉积Ni膜，在Cu基体上沉积Ag膜，在Fe基体沉积Cr膜，以及在Ag基体上沉积Ag 膜，在Ni基体上沉积Ni膜和在Cu基体上沉积Cu膜。采用悬臂梁法原位测量了除Cr膜外其他薄膜的平均内应力。结果表明，薄膜和基体为异种材料时薄膜内界面应力很大，而为同种材料时界面应力为零。由悬臂梁的弯曲方向得到的界面应力的性质与由改进的 Thomas?Fermi?Dirac 电子理论得到的结果一致。
Cu films on Fe, Ni and Ag substrates, Ni films on Fe and Ag substrates, Ag film on Cu substrate, Cr film on Fe substrate, Ag film on Ag substrate, Ni film on Ni substrate and Cu film on Cu substrate were deposited by electroplating. The average internal stress in all films, except Cr, was in-situ measured by the cantilever beam test. The interfacial stress is very large in the films with different materials with substrates and is zero in the films with the same material with substrates. The interfacial stress character obtained from the cantilever beam bending direction is consistent with that obtained from the modified Thomas–Fermi–Dirac electron theory.
参考文献
| [1] | G. Guisbiers;M. Wautelet;L. Buchaillot.Comparison of intrinsic residual stress models in metallic thin films[J].Scripta materialia,20096(6):419-422. |
| [2] | Thompson CV.;Carel R..STRESS AND GRAIN GROWTH IN THIN FILMS[J].Journal of the Mechanics and Physics of Solids,19965(5):657-673. |
| [3] | Wang P;Wang X;Xu T;Liu WM;Zhang JY.Comparing internal stress in diamond-like carbon films with different structure[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,200717(17):6899-6903. |
| [4] | F. Z. Ren;P. Liu;M. Zheng.Electron Theory Based Explanation and Experimental Study on Deformation Behavior of Cu/Ni Multilayers[J].Metals and Materials International,20044(4):337-341. |
| [5] | 任凤章;周根树;赵文轸;胡志忠;郑茂盛;鞠新华.Determination of interfacial fracture energies of Ni films on titanium and stainless steel substrates by peel test[J].中国有色金属学会会刊(英文版),2002(1):93-97. |
| [6] | 杨林;龙士国;马增胜;王子菡.平面应变鼓包实验测量薄膜力学性能的精度分析[J].中国有色金属学报（英文版）,2014(10):3265-3273. |
| [7] | Koch R..Intrinsic stress of ultrathin epitaxial films[J].Applied physics, A. Materials science & processing,19995(5):529-536. |
| [8] | Ren, F.Z.;Zhang, F.X.;Su, J.H.;Ma, Z.H.;Tian, B.H.;Jia, S.G..Analysis on residual stress in Cu film on Fe substrate-based on electron theory[J].Journal of computational and theoretical nanoscience,20129(9):1298-1302. |
| [9] | LIU Zhilin;LI Zhilin;SUN Zhenguo.Electron density of austenite/martensite biphase interface[J].Chinese science bulletin,19965(5):367-370. |
| [10] | Fengzhang Ren;Ke Cao;Jiangzhuo Ren;Alex A. Volinsky;Thanh Hai Tran;Baohong Tian.Numerical Calculation of the Electron Density at the Wigner-Seitz Radius Based on the Thomas-Fermi-Dirac Equation[J].Journal of computational and theoretical nanoscience,20142(2):344-347. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%