参考文献
[1] | Rabaey J M;Chandrakasan A;Nikolic B.Digital integrated circuits:a design perspective[M].New Jersey:Prentice-Hall,2003 |
[2] | Bakoglu H B;Meindl J D.Optimal interconnection circuits for VLSI[J].IEEE Transactions on Electron Devices,198532(5):903. |
[3] | Kevin T. Tang;Eby G. Friedman.Delay and noise estimation of CMOS logic gates driving coupled resistive--capacitive interconnections[J].Integration: The VLSI journal,20002(2):131-163. |
[4] | Sakurai T..Closed-form expressions for interconnection delay, coupling, and crosstalk in VLSIs[J].IEEE Transactions on Electron Devices,19931(1):118-124. |
[5] | Banerjee K.;Mehrotra A..Analysis of on-chip inductance effects for distributed RLC interconnects[J].IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems: A publication of the IEEE Circuits and Systems Society,20028(8):4-915. |
[6] | Tang K T;Friedman E G.Peak crosstalk noise estimation in CMOS VLSI circuits[A].,1999:1539. |
[7] | Agarwal K.;Sylvester D.;Blaauw D..Modeling and analysis of crosstalk noise in coupled RLC interconnects[J].IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems: A publication of the IEEE Circuits and Systems Society,20065(5):892-901. |
[8] | B.K. Kaushik;S. Sarkar.Crosstalk Analysis For A Cmos Gate Driven Inductively And Capacitively Coupled Interconnects[J].Microelectronics journal,200812(12):1834-1842. |
[9] | An analytical approach to dynamic crosstalk in coupled interconnects[J].Microelectronics journal,20102/3(2/3):85. |
[10] | Paul C.R..Incorporation of terminal constraints in the FDTD analysis of transmission lines[J].IEEE Transactions on Electromagnetic Compatibility,19942(2):85-91. |
[11] | Li, X.-C.;Mao, J.-F.;Swaminathan, M..Transient Analysis of CMOS-Gate-Driven $RLGC$ Interconnects Based on FDTD[J].IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems: A publication of the IEEE Circuits and Systems Society,20114(4):574-583. |
[12] | Vobulapuram Ramesh Kumar;Brajesh Kumar Kaushik;Amalendu Patnaik.An accurate model for dynamic crosstalk analysis of CMOS gate driven on-chip interconnects using FDTD method[J].Microelectronics journal,20144(4):441-448. |
[13] | Vobulapuram Ramesh Kumar;Brajesh Kumar Kaushik;Amalendu Patnaik.An Accurate FDTD Model for Crosstalk Analysis of CMOS-Gate-Driven Coupled RLC Interconnects[J].IEEE Transactions on Electromagnetic Compatibility,20145(5):1185-1193. |
[14] | Devendra Kumar Sharma;Brajesh Kumar Kaushik;R.K. Sharma.Signal integrity and propagation delay analysis using FDTD technique for VLSI interconnects[J].Journal of computational electronics,20141(1):300-306. |
[15] | Devendra Kumar Sharma;Brajesh Kumar Kaushik;R.K.Sharma.FDTD based transition time dependent crosstalk analysis for coupled RLC interconnects[J].半导体学报(英文版),2014(05):69-73. |
[16] | Daniele Rossi;Jos Manuel Cazeaux;Cecilia Metra;Fabrizio Lombardi.Modeling Crosstalk Effects in CNT Bus Architectures[J].IEEE transactions on nanotechnology,20072(2):133-145. |
[17] | Azad Naeemi;James D. Meindl.Design and Performance Modeling for Single-Walled Carbon Nanotubes as Local, Semiglobal, and Global Interconnects in Gigascale Integrated Systems[J].IEEE Transactions on Electron Devices,20071(1):26-37. |
[18] | Srivastava N;Banerjee K.Performance analysis of carbon nanotube interconnects for VLSI applications[A].,2005:383. |
[19] | Crosstalk Prediction of Single- and Double-Walled Carbon-Nanotube (SWCNT/DWCNT) Bundle Interconnects[J].IEEE Transactions on Electron Devices,20094(4):560. |
[20] | Feng Liang;Gaofeng Wang;Hai Lin.Modeling of Crosstalk Effects in Multiwall Carbon Nanotube Interconnects[J].IEEE Transactions on Electromagnetic Compatibility,20121(1):133-139. |
[21] | Duksh Y S;Kaushik B K;Sarkar S.Analysis of propagation delay and power with variation in driver size and number of shells in multiwalled carbon nanotube interconnects[J].J Eng Design Technol,201311(1):19. |
[22] | McEuen P L;Fuhrer M S;Park H.Single-walled carbon nanotube electronics[J].IEEE TRANSACTIONS ON NANOTECHNOLOGY,20021(1):78. |
[23] | Iijima S;Ichihashi T.Single-shell carbon nanotubes of 1-nm diameter[J].NATURE,1993363:603. |
[24] | Bethune D S;Kiang C H;Devries M S.Cobalt-catalyzed growth of carbon nanotubes with single-atomic-layerwalls[J].NATURE,1993363:605. |
[25] | Thess A;Lee R;Nikolaev P.Crystalline ropes of metallic carbon nanotubes[J].SCIENCE,1996273:483. |
[26] | Li, H.;Xu, C.;Srivastava, N.;Banerjee, K..Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects[J].IEEE Transactions on Electron Devices,20099(9):1799-1821. |
[27] | Anne-Claire Dupuis.The catalyst in the CCVD of carbon nanotubes—a review[J].Progress in materials science,20058(8):929-961. |
[28] | Graham AP;Duesberg GS;Hoenlein W;Kreupl F;Liebau M;Martin R;Rajasekharan B;Pamler W;Seidel R;Steinhoegl W.How do carbon nanotubes fit into the semiconductor roadmap?[J].Applied physics, A. Materials science & processing,20056(6):1141-1151. |
[29] | Futaba D N;Hata K;Namai T.84% catalyst activity of water-assisted growth of single walled carbon nanotube forest characterization by a statistical and macroscopic approach[J].Journal of Physical Chemistry B,2006110(15):8035. |
[30] | Maeda, Y;Kimura, S;Kanda, M;Hirashima, Y;Hasegawa, T;Wakahara, T;Lian, YF;Nakahodo, T;Tsuchiya, T;Akasaka, T.Large-scale separation of metallic and semiconducting single-walled carbon nanotubes[J].Journal of the American Chemical Society,200529(29):10287-10290. |
[31] | Futaba DN;Hata K;Yamada T;Hiraoka T;Hayamizu Y;Kakudate Y;Tanaike O;Hatori H;Yumura M;Iijima S.Shape-engineerable and highly densely packed single-walled carbon nanotubes and their application as super-capacitor electrodes[J].Nature materials,200612(12):987-994. |
[32] | Hayamizu Y;Yamada T;Mizuno K;Davis RC;Futaba DN;Yumura M;Hata K.Integrated three-dimensional microelectromechanical devices from processable carbon nanotube wafers[J].Nature nanotechnology,20085(5):289-294. |
[33] | Srivastava N;Li H;Kreupl F.On the applicability of single-walled carbon nanotubes as VLSI interconnects[J].IEEE TRANSACTIONS ON NANOTECHNOLOGY,20098(4):542. |
[34] | Kreupl F;Graham A P;Liebau M.Carbon nanotubes for interconnect applications[A].,2004:683. |
[35] | Raychowdhury A.;Roy K..Modeling of metallic carbon-nanotube interconnects for circuit simulations and a comparison with Cu interconnects for scaled technologies[J].IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems: A publication of the IEEE Circuits and Systems Society,20061(1):58-65. |
[36] | Paul C R.Analysis of multiconductor transmission lines[M].New Jersey:John Wiley and Sons,2008 |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%