蒸发金和芯片表层黑色颗粒分析

黄金, 2015, 36(11): 4-6. doi: 10.11792/hj20151102

蒸发金和芯片表层黑色颗粒分析

马晓霞 ^1, , 范红 ^2, , 李守生 ^3, , 李玉芹 ^4, , 杜晋峰 ^5,

1.山东招金集团有限公司;山东大学材料与科学工程学院

2.烟台招金励福贵金属股份有限公司

3.山东招金集团有限公司

4.烟台招金励福贵金属股份有限公司

5.神华国华(北京)电力研究院有限公司

关键词：蒸发金 , 芯片表面 , 黑色颗粒 , 电子束蒸发 , 铸造 , 塑性变形

Analysis on the black matter on the surface of evaporated gold and chip

Keywords： evaporated gold , surface of chip , black matter , electronic beam evaporation , casting , plastic de-formation

采用扫描电镜分析了蒸发金熔化凝固后表层以及蒸镀后在芯片表面形成的黑色颗粒的形貌和成分. 试验结果表明:该黑色颗粒成分主要为金,是其蒸发金和芯片表层与碳、氧等非金属杂质相混合,而非长期以来认为的石墨(碳)颗粒;分析确定了非金属杂质的来源,并从熔炼以及拉丝工艺环节提出了改进措施.

The morphology and composition of black particles forming on evaporated gold after melting and solidi-fication and on the surface of chips after vapor plating are analyzed by SEM. The experimental results show that the main composition of the black matter is gold and the surface of evaporated gold and chip is mixed with some non-me-tallic impurities such as C,O,etc. instead of graphite(C) as the traditional viewpoint believes. And the results also confirm the source of these impurities,and put forward some improvement measures for melting and drawing processes.

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