室温下将130 keV，5×1014 cm-2 B离子和55 keV，1×1016 cm-2 H离子单独或顺次注入到单晶Si中，采用横截面试样透射电子显微镜(XTEM)和慢正电子湮没技术(SPAT)研究了离子注入引起的微观缺陷的产生及其热演变。XTEM观测结果显示，B和H离子顺次注入到单晶Si可有效减少(111)取向的H板层缺陷，并促进了(100)取向的H板层缺陷的择优生长。SPAT观测结果显示，在顺次注入的样品中，B离子平均射程处保留了大量的空位型缺陷。以上结果表明，B离子本身及B离子注入所产生的空位型缺陷对板层缺陷的生长起到了促进作用。
Cz n-type Si (100) wafers were singly or sequentially implanted at room temperature with 130 keV B ions at a fluence of 5 × 1014 cm-2 and 55 keV H ions at a fluence of 1 × 1016 cm-2 . The implantation-induced defects were investigated in detail by using cross-sectional transmission electron microscopy (XTEM) and slow positron annihilation technique (SPAT). XTEM results clearly show that sequential implantation of B and H ions into Si could eliminate the (111) platelets and promote growth of (100) platelets during annealing. SPAT measurements demonstrate that in B and H sequentially implanted and annealed Si, more vacancy-type defects could remain in sample region around the range of B ions. These results indicate that the promotion effect should be attributed to the role of both B and B implanted induced vacancy-type defects.
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