欢迎登录材料期刊网

材料期刊网

高级检索

综述了应用于电子器件热管理的金属/碳复合材料,重点包括金属/碳复合材料的制备方法,同时介绍了与金属复合的不同种类碳材料,并归纳总结了此类复合材料的导热性能,最后介绍了一些已经商品化的金属/碳热管理复合材料.

参考文献

[1] 李志强;谭占秋;范根莲;张荻.高效热管理用金属基复合材料研究进展[J].中国材料进展,2013(7):431-440.
[2] Shaoxin Zhou;Jinzao Xu;Quan-Hong Yang.Experiments and modeling of thermal conductivity of flake graphite/polymer composites affected by adding carbon-based nano-fillers[J].Carbon: An International Journal Sponsored by the American Carbon Society,2013:452-459.
[3] Novel processing and characterization of Cu/CNF nanocomposite for high thermal conductivity applications[J].Composites science and technology,200914(14):2474.
[4] Balandin AA;Ghosh S;Bao WZ;Calizo I;Teweldebrhan D;Miao F;Lau CN.Superior thermal conductivity of single-layer graphene[J].Nano letters,20083(3):902-907.
[5] Coe S.E.;Sussmann R.S..Optical, thermal and mechanical properties of CVD diamond[J].Diamond and Related Materials,19999-10(9-10):1726-1729.
[6] Toshiyuki Ueno;Takashi Yoshioka;Jin-ichi Ogawa.Highly thermal conductive metal/carbon composites by pulsed electric current sintering[J].Synthetic Metals,200921/22(21/22):2170-2172.
[7] 方针正;林晨光;张小勇;陆艳杰;刘鑫.金刚石/Cu复合材料的烧结致密化研究[J].稀有金属,2008(3):306-310.
[8] J.K. Chen;I.S.Huang.Thermal properties of aluminum-graphite composites by powder metallurgy[J].Composites, Part B. Engineering,20131(1):698-703.
[9] K. Prakasan;S. Seshan.Microstructure and properties of squeeze cast Cu-carbon fibre metal matrix composite[J].Journal of Materials Science,199920(20):5045-5049.
[10] 张广安;罗守靖;田文彤.短碳纤维增强铝基复合材料的挤压浸渗工艺[J].中国有色金属学报,2002(3):525-528.
[11] Liping Ran;Ke Peng;Maozhong Yi;Lin Yang.Ablation property of a C/C-Cu composite prepared by pressureless infiltration[J].Materials Letters,201113(13):2076-2078.
[12] YingHu Dong;RuiQjng Zhang;XinBo He.Fabrication and infiltration kinetics analysis of Ti-coated diamond/copper composites with near-net-shape by pressureless infiltration[J].Materials Science & Engineering, B. Solid-State Materials for Advanced Technology,201217(17):1524-1530.
[13] 胡锐;李金山;毕晓勤;朱冠勇;傅恒志.石墨/铜基复合材料真空液相浸渗过程动力学研究[J].西北工业大学学报,2004(3):296-300.
[14] T.Etter;P.J.Uggowitzer;M.Papakyriacou;P.Schulz.Physical properties of graphite/aluminium composites produced by gas pressure infiltration method[J].Carbon: An International Journal Sponsored by the American Carbon Society,20035(5):1017-1024.
[15] J.-M. Molina;M. Rheme;J. Carron.Thermal conductivity of aluminum matrix composites reinforced with mixtures of diamond and SiC particles[J].Scripta materialia,20085(5):393-396.
[16] R. Prieto;J.M. Molina;J. Narciso.Thermal conductivity of graphite flakes-SiC particles/metal composites[J].Composites, Part A. Applied science and manufacturing,201112(12):1970-1977.
[17] Prieto R;Molina JM;Narciso J;Louis E.Fabrication and properties of graphite flakes/metal composites for thermal management applications[J].Scripta materialia,20081(1):11-14.
[18] Zechao Tao;Quangui Guo;Xiaoqing Gao;Lang Liu.Graphite fiber/copper composites with near-zero thermal expansion[J].Materials & design,2012Jan.(Jan.):372-375.
[19] Liu, Qian;He, Xin-Bo;Ren, Shu-Bin;Liu, Ting-Ting;Kang, Qi-Ping;Qu, Xuan-Hui.Fabrication and thermal conductivity of copper matrix composites reinforced with Mo2C or TiC coated graphite fibers[J].Materials Research Bulletin: An International Journal Reporting Research on Crystal Growth and Materials Preparation and Characterization,201311(11):4811-4817.
[20] Moonhee Lee;Yongbum Choi;Kenjiro Sugio;Kazuhiro Matsugi;Gen Sasaki.Effect of aluminum carbide on thermal conductivity of the unidirectional CF/Al composites fabricated by low pressure infiltration process[J].Composites science and technology,2014Jun.16(Jun.16):1-5.
[21] Katsuhito Yoshida;Hideaki Morigami.Thermal properties of diamond/copper composite material[J].Microelectronics and reliability,20042(2):303-308.
[22] O. Beffort;F.A. Khaltd;L. Weber.Interface formation in infiltrated Al(Si)/diamond composites[J].Diamond and Related Materials,20069(9):1250-1260.
[23] E.A. Ekimov;N.V. Suetin;A.F. Popovich.Thermal conductivity of diamond composites sintered under high pressures[J].Diamond and Related Materials,20084/5(4/5):838-843.
[24] Zhanqiu Tan;Zhiqiang Li;Genlian Fan;Qiang Guo;Xizhou Kai;Gang Ji;Lanting Zhang;Di Zhang.Enhanced thermal conductivity in diamond/aluminum composites with a tungsten interface nanolayer[J].Materials & design,2013May(May):160-166.
[25] I.E. Monje;E. Louis;J.M. Molina.Optimizing thermal conductivity in gas-pressure infiltrated aluminum/diamond composites by precise processing control[J].Composites, Part A. Applied science and manufacturing,2013:9-14.
[26] Seungchan Cho;Keiko Kikuchi;Takamichi Miyazaki;Kenta Takagi;Akira Kawasaki;Takayuki Tsukada.Multiwalled carbon nanotubes as a contributing reinforcement phase for the improvement of thermal conductivity in copper matrix composites[J].Scripta materialia,20104(4):375-378.
[27] R. Sule;P.A. Olubambi;I. Sigalas.Effect of SPS consolidation parameters on submicron Cu and Cu-CNT composites for thermal management[J].Powder Technology: An International Journal on the Science and Technology of Wet and Dry Particulate Systems,2014:198-205.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%