随着大功率LED向高电流密度、高光通量发展，热流密度猛增使得LED散热问题日益严重。封装基板对LED的散热至关重要。在简介LED的封装结构及散热方式的基础上，分析总结了常见封装基板材料的性能参数，并对目前市场常见封装基板MCPCB、DBC、DAB、DPC、LTCC、HTCC、Al／SiC以及最近出现的新型材料基板的特征、制造工艺、应用等进行了综述。
As the current density and light flux of high-power LED become higher and higher,the heat dissipa-tion for high-power LED is becoming more and more important.The packaging substrate is a crucial channel for heat dissipation in LED lighting.In this paper,the structure of LED packaging and heat dissipation characteristics of LED are introduced briefly.The performance of some packaging substrate materials is summarized.Finally,the characte-ristic,manufacturing processes,applications of common substrates,such as MCPCB,DBC,DAB,DPC,LTCC, HTCC,Al/SiC,as well as the new kinds of substrate materials are reviewed respectively.
参考文献
| [1] | 汤坤;卓宁泽;施丰华;邢海东;刘光熙;王海波.LED 封装的研究现状及发展趋势[J].照明工程学报,2014(1):26-30. |
| [2] | 曾婧;彭超群;王日初;王小锋.电子封装用金属基复合材料的研究进展[J].中国有色金属学报,2015(12):3255-3270. |
| [3] | Hsueh-Han Wu;Kuan-Hong Lin;Shun-Tian Lin.A study on the heat dissipation of high power multi-chip COB LEDs[J].Microelectronics journal,20124(4):280-287. |
| [4] | 王忠锋;黄伟玲;白金强.大功率 LED 灯具散热的优化设计[J].照明工程学报,2014(3):84-88. |
| [5] | 曾小亮;孙蓉;于淑会;许建斌;汪正平.电子封装基板材料研究进展及发展趋势[J].集成技术,2014(6):76-83. |
| [6] | 晏建宇;王双喜;刘高山;叶家星.大功率LED散热技术研究进展[J].照明工程学报,2013(5):84-89,98. |
| [7] | 欧阳雪琼;王双喜;郑琼娜;张红霞.大功率LED用封装基板研究进展[J].电子与封装,2011(4):1-5,16. |
| [8] | 张鹏飞;傅仁利;钱斐;方军;蒋维娜.化学镀铜对厚膜敷铜陶瓷基板敷铜层的影响[J].电子元件与材料,2014(2):39-42. |
| [9] | Khazaka, R.;Mendizabal, L.;Henry, D.;Hanna, R..Survey of High-Temperature Reliability of Power Electronics Packaging Components[J].IEEE Transactions on Power Electronics,20155(5):2456-2464. |
| [10] | 李明鹤;彭雷;王文峰.氮化铝-铝复合封装基板的制备[J].电子与封装,2014(4):5-8. |
| [11] | 刘伟南;韩亚苓;刘玉微;马智欣;韩睿.氧化铝/氮化铝陶瓷显微组织研究[J].硅酸盐通报,2015(7):2052-2056. |
| [12] | 薛生杰 .大功率LED散热用陶瓷金属基板的制备与性能研究[D].重庆大学,2014. |
| [13] | Cheah, Kean How;Low, Kay-Soon.Fabrication and performance evaluation of a high temperature co-fired ceramic vaporizing liquid microthruster[J].Journal of Micromechanics and Microengineering,20151(1) |
| [14] | 严蓉;戴雷;曹常胜.低温共烧陶瓷翘曲度改进工艺研究[J].固体电子学研究与进展,2014(2):192-196. |
| [15] | 何中伟;高鹏.平面零收缩LTCC基板制作工艺研究[J].电子与封装,2013(10):14-18. |
| [16] | Qing, Zhenjun;Li, Bo;Li, Hao;Li, Yingxiang;Zhang, Shuren.Fabrication and properties of Li2O-Al2O3-SiO2 glass/Al2O3 composites for low temperature co-fired ceramic applications[J].Journal of Materials Science. Materials in Electronics,20153(3):1789-1794. |
| [17] | 刘玫潭;蔡旭升;李国强.高性能 SiC 增强 Al 基复合材料的显微组织和热性能[J].中国有色金属学报,2013(4):1040-1046. |
| [18] | 朱梦剑;李顺;赵恂;熊德赣.具有双层结构的电子封装用可激光焊接Sip-SiCp/Al混杂复合材料[J].中国有色金属学报（英文版）,2014(4):1032-1038. |
| [19] | Kiyoshi Mizuuchi;Kanryu Inoue;Yasuyuki Agari;Torn Nagaoka;Masami Sugioka;Motohiro Tanaka;Takashi Takeuchi;Jun-ichi Tani;Masakazu Kawahara;Yukio Makino;Mikio Ito.Processing of Al/SiC composites in continuous solid-liquid co-existent state by SPS and their thermal properties[J].Composites, Part B. Engineering,20124(4):2012-2019. |
| [20] | 金灿灿;王太保;胡春峰;梁田;杨建;丘泰.热压烧结制备AlN/BN复相陶瓷及其性能研究[J].人工晶体学报,2015(6):1591-1596. |
| [21] | Sae Han Na Doo;Won Bae Lim;Jun Seok Lee.Silicon Carbide Whisker-Reinforced Ceramic Tape for High-Power Components[J].International journal of applied ceramic technology,20142(2):240-245. |
| [22] | Mingsheng Ma;Zhifu Liu;Yongxiang Li.Enhanced thermal conductivity of low-temperature sintered borosilicate glass-AIN composites with β-Si_3N_4 whiskers[J].Journal of the European Ceramic Society,20134(4):833-839. |
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