采用 Sn3.0Ag0.5Cu3.0Bi 软钎料对镀镍后的两种不同体积比 SiCp/6063Al 复合材料进行真空钎焊。通过 SEM、剪切试验等方法分析了化学镀镍后 SiCp/6063Al 复合材料真空钎焊接头的显微组织以及保温时间对接头性能的影响。结果表明：两种不同体积比 SiCp/6063Al 复合材料真空钎焊后的焊缝组织致密，钎料对镀镍复合材料的润湿性良好；在270℃、保温35 min 的钎焊工艺下，钎焊接头的剪切强度最大值为38.3 MPa；钎料中的 Sn、Cu 元素能够与复合材料表面的 Ni 层发生化学反应，实现钎料与母材的冶金结合；镀镍后 SiCp/6063Al 复合材料真空钎焊接头断裂形式为韧性断裂为主的混合断裂，断裂主要发生在钎料内部，部分发生在镀镍层与钎料的结合处。
SiCp/6063Al composite containing high and low volume fraction SiC after electroless nickel plating were soldered by using Sn3.0Ag0.5Cu3.0Bi solder in vacuum.The vacuum soldered joint microstructure between SiCp/6063Al composite after electroless nickel plating and the effect of holding time on the property of joint were stu-died by means of SEM and shearing test.The results showed that the microstructure of soldering seam was quite com-pact since the lead-free solder could wet SiCp/6063Al composite after electroless nickel plating very well.The shear strength of the soldered joint reached to maximum of 38.3 MPa under soldering temperature of 270 ℃ and holding time for 35 min.The element Sn and Cu from the solder reacted with Ni on the SiCp/6063Al composite,resulting in a metallurgical bonding between the solder and base material.The fracture mode of soldered joint of the SiCp/6063Al composite after electroless nickel plating was mixed ductile mainly of ductile fracture.Fracture occurred in the solder mostly and occurred around the IMC layer rarely.
参考文献
| [1] | 牛济泰.SiCW/6061Al铝基复合材料激光焊机理[J].焊接学报,2000(01):1. |
| [2] | 崔岩.碳化硅颗粒增强铝基复合材料的航空航天应用[J].材料工程,2002(06):3-6. |
| [3] | 苏斌;严红革;陈吉华;陈刚;杜嘉庆.硅含量对喷射沉积SiCp/Al-Si功能梯度复合材料摩擦磨损性能的影响[J].中国有色金属学报,2013(1):201-211. |
| [4] | 刘玫潭;蔡旭升;李国强.高性能 SiC 增强 Al 基复合材料的显微组织和热性能[J].中国有色金属学报,2013(4):1040-1046. |
| [5] | Li LB;An MZ;Wu GH.A new electroless nickel deposition technique to metallise SiCp/Al composites[J].Surface & Coatings Technology,200616/17(16/17):5102-5112. |
| [6] | 尹明勇;马立群;王娟;金荣荣;丁毅.SiCp／Al复合材料表面化学镀镍磷合金层的工艺改进[J].机械工程材料,2012(09):47-49,77. |
| [7] | 高增;牛济泰;李强.SiCp/Al复合材料的钎焊性及其钎焊连接研究进展[J].热加工工艺,2011(1):143-145,148. |
| [8] | 张洋 .超声波作用下SiC与Zn-Al连接界面行为及焊缝强化机理[D].哈尔滨工业大学,2009. |
| [9] | 谷博;王珺;唐兴勇;俞宏坤;肖斐.Sn-Ag-Cu和Sn-Ag-Bi焊料在Ni-P基板上焊点剪切强度的分析[J].复旦学报（自然科学版）,2006(4):501-505. |
| [10] | F.D.Bruce Houghton.ITRI project on electroless nickel/immersion gold joint cracking[J].Circuit world,20002(2):10-16. |
| [11] | 王丽凤;申旭伟;孙凤莲;刘洋.微量Ni对Sn-3.0Ag-0.5Cu钎料及焊点界面的影响[J].电子元件与材料,2008(9):65-68. |
| [12] | C. E. Ho;S. C. Yang;C. R. Kao.Interfacial reaction issues for lead-free electronic solders[J].Journal of Materials Science. Materials in Electronics,20071/3(1/3):155-174. |
| [13] | Hitoshi Sakurai;Keun-Soo Kim;Kiju Lee;Chang-Jae Kim;Youichi Kukimoto;Katsuaki Suganuma.Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish[J].Microelectronics and reliability,201211(11):2716-2722. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%