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氮极性(N-polar)GaN与镓极性(Ga-polar)GaN 极性相反,且具有较高的表面化学活性,使其在光电子、微电子及传感器等领域逐渐受到关注。文章结合一些相关研究报道,综述了 N-polar GaN 上欧姆接触的研究进展。首先对 N-polar GaN材料的制备进行了分析,随后对 N-polar GaN的欧姆接触电极的金属化方案及欧姆接触机理等内容进行了综合讨论,以期为实际 N-polar GaN欧姆接触研究提供一些参考。

N-polar GaN has high chemical activity and opposite polarity compared with conventional Ga-polar GaN,which make it receive a lot of attention recently in some study areas such as optoelectronics,microelectronics and sensor.Combined with some reports,the research progress of Ohmic contacts to N-polar GaN is reviewed.First-ly,the material preparations of N-polar GaN are analyzed.Subsequently,the metallization scheme of Ohmic contact e-lectrode and the Ohmic contact mechanism are comprehensively discussed in order to provide some references for the research of Ohmic contacts to N-polar GaN.

参考文献

[1] Hurni, Christophe A.;David, Aurelien;Cich, Michael J.;Aldaz, Rafael I.;Ellis, Bryan;Huang, Kevin;Tyagi, Anurag;DeLille, Remi A.;Craven, Michael D.;Steranka, Frank M.;Krames, Michael R..Bulk GaN flip-chip violet light-emitting diodes with optimized efficiency for high-power operation[J].Applied physics letters,20153(3):031101-1-031101-4.
[2] Rumin Gong;Jinyan Wang;Shenghou Liu;Zhihua Dong;Min Yu;Cheng P. Wen;Yong Cai;Baoshun Zhang.Analysis of surface roughness in Ti/Al/Ni/Au Ohmic contact to AlGaN/GaN high electron mobility transistors[J].Applied physics letters,20106(6):062115-1-062115-3.
[3] Wang L;Mohammed FM;Adesida I.Dislocation-induced nonuniform interfacial reactions of Ti/Al/Mo/Au ohmic contacts on AlGaN/GaN heterostructure[J].Applied physics letters,200514(14):1915-1-1915-3-0.
[4] Wang L;Mohammed FM;Adesida I.Differences in the reaction kinetics and contact formation mechanisms of annealed Ti/Al/Mo/Au Ohmic contacts on n-GaN and AlGaN/GaN epilayers[J].Journal of Applied Physics,20071(1):13702-1-13702-11-0.
[5] Kuang-Po Hsueh;Kuo-Chun Chiang;Yue-Ming Hsin;Charles J. Wang.Investigation of Cr- and Al-based metals for the reflector and Ohmic contact on n-GaN in GaN flip-chip light-emitting diodes[J].Applied physics letters,200619(19):191122-1-191122-3-0.
[6] Motayed, A.;Bonevich, J.E.;Krylyuk, S.;Davydov, A.V.;Aluri, G.;Rao, M.V..Correlation between the performance and microstructure of Ti/Al/Ti/Au ohmic contacts to p-type silicon nanowires[J].Nanotechnology,20117(7):075206-1-075206-10.
[7] Kong, X.;Wei, K.;Liu, G.;Liu, X..Role of Ti/Al relative thickness in the formation mechanism of Ti/Al/Ni/Au Ohmic contacts to AlGaN/GaN heterostructures[J].Journal of Physics, D. Applied Physics: A Europhysics Journal,201226(26):265101-1-265101-7.
[8] Ferdinando Iucolano;Giuseppe Greco;Fabrizio Roccaforte.Correlation between microstructure and temperature dependent electrical behavior of annealed Ti/Al/Ni/Au Ohmic contacts to AlGaN/GaN heterostructures[J].Applied physics letters,201320(20):201604-1-201604-4.
[9] Lin Zhou;Jacob H. Leach;Xianfeng Ni;Hadis Morkoc;David J. Smith.Ti/Al/Ni/Au Ohmic contacts for AlInN/AlN/GaN-based heterojunction field-effect transistors[J].Journal of Applied Physics,20101(1):014508-1-014508-5.
[10] Mohammed FM;Wang L;Koo HJ;Adesida I.Anatomy-performance correlation in Ti-based contact metallizations on AlGaN/GaN heterostructures[J].Journal of Applied Physics,20073(3):33706-1-33706-15-0.
[11] Wang L;Mohammed FM;Adesida I.Characterization of Au and Al segregation layer in post-annealed thin Ti/Al/Mo/Au Ohmic contacts to n-GaN[J].Journal of Applied Physics,200510(10):6105-1-6105-3-0.
[12] Seongjun Kim;Jae-Hyun Ryou;Russell D. Dupuis;Hyunsoo Kim.Carrier transport mechanism of low resistance Ti/Al/Au ohmic contacts to AlInN/GaN heterostructures[J].Applied physics letters,20135(5):052107-1-052107-4.
[13] X. J. Chen;G. Perillat-Merceroz;D. Sam-Giao;C. Durand;J. Eymery.Homoepitaxial growth of catalyst-free GaN wires on N-polar substrates[J].Applied physics letters,201015(15):151909-1-151909-3.
[14] Ho Won Jang;Jung-Hee Lee;Jong-Lam Lee.Characterization of band bendings on Ga-face and N-face GaN films grown by metalorganic chemical-vapor deposition[J].Applied physics letters,200221(21):3955-3957.
[15] Jang, HW;Lee, S;Ryu, SW;Son, JH;Song, YH;Lee, JL.Interfacial Band Bendings in Al Ohmic Contacts to Laser-Irradiated Ga-Face and N-Face n-GaN[J].Electrochemical and solid-state letters,200911(11):H405-H407.
[16] 封飞飞;刘军林;邱冲;王光绪;江凤益.硅衬底GaN基LED N极性n型欧姆接触研究[J].物理学报,2010(8):5706-5709.
[17] Jun-Seok Ha;Lee S.W.;Hyun-Jae Lee;Lee Hyo-Jong;Lee S.H.;Goto H.;Kato T.;Fujii K.;Cho M.W.;Yao T..The Fabrication of Vertical Light-Emitting Diodes Using Chemical Lift-Off Process[J].IEEE Photonics Technology Letters,20083(3):175-177.
[18] M. Sumiya;M. Tanaka;K. Ohtsuka.Analysis of the polar direction of GaN film growth by coaxial impact collision ion scattering spectroscopy[J].Applied physics letters,19995(5):674-676.
[19] E. Monroy;E. Sarigiannidou;F. Fossard;N. Gogneau;E. Bellet-Amalric;J.-L. Rouviere;S. Monnoye;H. Mank;B. Daudin.Growth kinetics of N-face polarity GaN by plasma-assisted molecular-beam epitaxy[J].Applied physics letters,200418(18):3684-3686.
[20] P.R. Tavernier;T. Margalith;J. Williams;D.S. Green;S. Keller;S.P. DenBaars;U.K. Mishra;S. Nakamura;D.R. Clarke.The growth of N-face GaN by MOCVD: effect of Mg, Si, and In[J].Journal of Crystal Growth,20041/3(1/3):150-158.
[21] Joon Seop Kwak;K. Y. Lee;J. Y. Han;J. Cho;S. Chae;O. H. Nam;Y. Park.Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate[J].Applied physics letters,200120(20):3254-3256.
[22] Hyunsoo Kim;Jae-Hyun Ryou;Russell D. Dupuis;Sung-Nam Lee;Yongjo Park;Joon-Woo Jeon;Tae-Yeon Seong.Electrical characteristics of contacts to thin film N-polar n-type GaN[J].Applied physics letters,200819(19):192106-1-192106-3-0.
[23] Junlin Liu;Feifei Feng;Yinhua Zhou;Jianli Zhang;Fengyi Jiang.Stability of Al/Ti/Au contacts to N-polar n-GaN of GaN based vertical light emitting diode on silicon substrate[J].Applied physics letters,201111(11):111112-1-111112-3.
[24] Jeon, J.-W.;Lee, S.Y.;Song, J.O.;Seong, T.-Y..Low-resistance Cr/Al Ohmic contacts to N-polar n-type GaN for high-performance vertical light-emitting diodes[J].Current applied physics: the official journal of the Korean Physical Society,20121(1):225-227.
[25] Kim, S. J.,Nam, T. Y.,Kim, T. G..Low-Resistance Nonalloyed Ti/Al Ohmic Contacts on N-Face n-Type GaN via an $hbox{O}_{2}$ Plasma Treatment[J].IEEE Electron Device Letters,20112(2):149-151.
[26] Kim, S. J.;Jeong, T.;Kim, T. G..Improved Thermal Stability and Reduced Contact Resistance of Ohmic Contacts on N-Face n-Type GaN With Laser-Assisted Doping[J].IEEE Electron Device Letters,20133(3):372-374.
[27] Cho HK;Kim SK;Lee JS.An improved non-alloyed ohmic contact Cr/Ni/Au to n-type GaN with surface treatment[J].Journal of Physics, D. Applied Physics: A Europhysics Journal,200817(17):175107-1-175107-4-0.
[28] ZENG Chang;JIANG De-Sheng;YANG Hui;ZHANG Shu-Ming;WANG Hui;LIU Jian-Ping;WANG Huai-Bing;LI Zeng-Cheng;FENG Mei-Xin;ZHAO De-Gang;LIU Zong-Shun.Formation of Low-Resistant and Thermally Stable Nonalloyed Ohmic Contact to N-Face n-GaN[J].中国物理快报(英文版),2012(1):220-223.
[29] Luther BP;DeLucca JM;Mohney SE;Karlicek RF;Penn State Univ Dept Mat Sci & Engn University Pk PA 16802 USA.;EMCORE Corp Somerset NJ 08873 USA..Analysis of a thin AlN interfacial layer in Ti/Al and Pd/Al ohmic contacts to n-type GaN[J].Applied physics letters,199726(26):3859-3861.
[30] 王现彬;赵正平;冯志红.N极性GaN/AlGaN异质结二维电子气模拟[J].物理学报,2014(8):080202-1-080202-8.
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