影响LED出光效率的关键因素是芯片顶部的封装材料,芯片顶部封装要求材料具有高透光率、高折射率和高抗老化能力.对纳米MgO和纳米ZnO进行表面改性处理,并按一定的比例加入到环氧树脂中,制备出LED顶部封装材料,既提高了LED的出光效率又简化了封装工艺.结果表明,在纳米ZnO和纳米MgO的共同作用下,L ED的出光效率相对于纯环氧封装提高了10.57％,相对于有机硅树脂双层结构封装提高了11.14％,同时提高了LED封装材料的光学稳定性.
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