利用Matlab编程模拟仿真了GaN/SiC异质结的正向恢复过程.讨论了GaN/SiC异质结的模型,分析了异质结的外因(外加电流变化率、温度等)及内因(N区掺杂浓度、电子迁移率等)对异质结正向峰值电压和正向恢复时间的影响,对比了GaN/6H-SiC、GaN/4H-SiC、GaN/3C-SiC三种异质结的正向恢复过程.结果表明,前述内、外因素对GaN/SiC异质结的正向恢复有明显影响,可通过调节各参数以优化GaN/SiC异质结的正向恢复过程.
参考文献
[1] | Liang Y.-C.;Gosbell V.J..Diode forward and reverse recovery model for power electronic SPICE simulations[J].IEEE Transactions on Power Electronics,19903(3):346-356. |
[2] | Tseng KJ..Modelling of diode forward recovery characteristics using a modified charge-control equation[J].International Journal of Electronics: Theoretical & Experimental,19985(5):437-444. |
[3] | Cho, J.;Bozorg-Grayeli, E.;Altman, D. H.;Asheghi, M.;Goodson, K. E..Low Thermal Resistances at GaN–SiC Interfaces for HEMT Technology[J].IEEE Electron Device Letters,20123(3):378-380. |
[4] | Bellone, S.;Corte, F. G. D.;Albanese, L.;Pezzimenti, F..An Analytical Model of the Forward I– V Characteristics of 4H-SiC p-i-n Diodes Valid for a Wide Range of Temperature and Current[J].IEEE Transactions on Power Electronics,201110(10):2835-2843. |
[5] | 黄京才;白朝辉.碳化硅器件发展概述[J].山西电子技术,2011(4):90-91,96. |
[6] | T T Mnatsakanov;M E Levinshtein;L I Pomortseva.Carrier mobility model for simulation of SiC-based electronic devices[J].Semiconductor Science and Technology,20029(9):974-977. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%