含芳基噻唑基团环氧树脂材料的制备及热性能

应用化学, 2016, 33(3): 293-298. doi: 10.11944/j.issn.1000-0518.2016.03.150251

含芳基噻唑基团环氧树脂材料的制备及热性能

1.福建师范大学材料科学与工程学院,福建省高分子材料重点实验室福州,350007

2.福建师范大学材料科学与工程学院,福建省高分子材料重点实验室福州,350007

3.福建师范大学材料科学与工程学院,福建省高分子材料重点实验室福州,350007

4.福建师范大学材料科学与工程学院,福建省高分子材料重点实验室福州,350007

基金项目: 福建省中青年教师教育科研项目(JA15107) the Innovation and Entrepreneurship for Undergraduates of Fujian Normal University(cxxl-2015106) 福建师范大学大学生创新创业训练计划(cxxl-2015106)资助 Supported by the Natural Science Foundation of Fujian Province of China(2015J05095) 福建省自然科学基金项目(2015J05095) the Education Scientific Research Project for Young Teachers of Fujian Province(JA15107)

关键词：环氧树脂 , 制备 , 热解动力学 , 热性能

Preparation and Thermal Property of Epoxy Resin Containing Aromatic Thiazole Groups

Keywords： epoxy resin , preparation , thermal degradation kinetics , thermal stability

制备了一种含芳基噻唑基团热稳定环氧树脂材料(TDABZ),通过傅里叶变换红外光谱(FTIR)对其结构进行了表征,采用热重分析-微熵热重分析(TGA-DTG)计算了TDABZ的热分解动力学参数,利用热重分析(TGA)和动态热机械分析(DMTA)探讨了TDABZ的耐热性能.结果表明,TDABZ通过TGDDM结构中的环氧基团与混合固化剂(DDS和2-ABZ)结构中的活泼氢反应,在较低的温度下就能完全交联固化.通过Kissinger和Ozawa方法求得TDABZ的热分解活化能分别为205.5和221.9 kJ/mol.TDABZ固化物具有优异的耐热性能,双悬臂梁法测得的玻璃化转变温度(Tg)达到242.3℃,在N2气气氛下失重5％对应的温度(Td5)为340.2℃,最大失重速率对应的温度(Tdmax)为395.5℃,600℃的质量保留率为24.1％,显著提高了环氧树脂的热稳定性能,拓宽了其应用领域.

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