为实现不锈钢封装板件的高效率低成本批量化制造,开展了不锈钢薄板微冲压工艺研究。设计了集自动送料、辅助定位、落料、微冲孔以及微拉深于一体的高效、复杂、高精度封装板级进模具装置,分析成形条件对成形质量的影响规律,确定最佳工艺参数。同时,进行了不锈钢封装板抗冲击性能测试。结果表明:采用该复杂一体化级进式微冲压成形模具装置,制造出质量良好的不锈钢封装板件,成形效率可达1120件/h;在超过47800 g的超负荷条件下,封装板表面平整,未出现明显变形,能够满足机械性能要求。采用这种高效率微冲压成形技术,能够解决微型构件的尺寸精度,提高微型构件的力学性能,有效降低生产成本,实现了封装板件的高效率低成本批量化制造。
To realize high efficiency, low cost batch manufacturing of stainless steel package substrate, the micro stamping process of the stainless steel sheet was studied. Multi?functions of the automatic feeding, positioning, blanking, micro?punching and micro deep drawing was designed into an efficient, complex, high precision package substrate device. To analyze the Influence of molding conditions on the forming quality, the optimal process parameters were determined. At the same time, the shock resistance performance of stainless steel plates was tested. The obtained results show thatusing this the complex integration progressive micro stamping die device can create high quality stainless steel package substrates with a forming efficiency up to 1 120 pieces/h. With overloading of above 47 800 g, package substrates remain surface flat without obvious deformation, which can meet the performance requirements of mechanical property. Using this efficient micro forming technology can solve the size precision of micro components, improve the mechanical properties of micro components,, reduce the production cost, and realize high efficiency, low cost package substrate batch manufacturing.
参考文献
[1] | 王振龙.微细加工技术[M].北京:国防工业出版社,2005:1-3,77-80. |
[2] | 温诗铸,李娜.微型机械与纳米机械学研究[J].中国机械工程,1996(02):17. |
[3] | 苑伟政;马炳和.微机械与微细加工技术[M].西安:西北工业大学出版社,2000 |
[4] | 单德彬,郭斌,周健.金属薄板微成形技术的研究进展[J].塑性工程学报,2007(03):93-99. |
[5] | U. Engel;R. Eckstein .Microforming-from basic research to its realization[J].Journal of Materials Processing Technology,2002(0):35-44. |
[6] | HU Z;VOLLERTSEN F.Fabrication test for deep drawing with respect to size effects[A].Harbin:ICNFT,2004:153-158. |
[7] | PUCHERH J.FE-simulation of micro bending[A].Bamberg:Meisenbach Verlag,1999:513-519. |
[8] | LEE W B;CHEUNG C F;CHAN L K et al.An investigation of process parameters in the dam-bar cutting of integrated circuit packages[J].Journal of Materials Processing Technology,1997,66:63-72. |
[9] | Byung-Yun Joo;Sung-Han Rhim;Soo-Ik Oh .Micro-hole fabrication by mechanical punching process[J].Journal of Materials Processing Technology,2005(3):593-601. |
[10] | Isamu Aoki;Masahiro Sasada;Toshiro Higuchi;Takeshi Yano .Development of micro-piercing system with punch-damage monitoring function[J].Journal of Materials Processing Technology,2002(0):497-502. |
[11] | Yasunori Saotome;Kaname Yasuda;Hiroshi Kaga .Microdeep drawability of very thin sheet steels[J].Journal of Materials Processing Technology,2001(1/3):641-647. |
[12] | KATOU Y;KONO E.Solder bump forming using Micro Punching Technology[A].Piscataway,NJ:IEEE,1995:117-120. |
[13] | TAGO H;BONKOHARA M;KATOU Y.An approach to the low cost flip-chip technology development with punched-out solder disks by micro-press punching method[A].Piscataway,NJ:IEEE,1996:34-38. |
[14] | QIN Y .Micro-forming and miniature manufacturing system-development needs and perspectives[J].Journal of Materials Processing Technology,2006,177(1/2/3):8-18. |
[15] | RAZALI A;QIN Y;HARRISON C S et al.Investi-gation of feeding decices and development of design considerations for a new feeder for micro-sheet forming[J].International Journal of Nanomanufaturing,2009,3(1/2):40-54. |
[16] | 飞尚才 .SUS304不锈钢冷轧及退火工艺对组织和性能的影响[D].兰州:兰州理工大学,2011. |
- 下载量()
- 访问量()
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%