超声振动能很好地改善硬脆性材料的加工性能，为了探索超声振动锯切比能对单晶硅的影响，本文采用薄金刚石锯片，在有无超声振动的条件下对单晶硅进行锯切实验。实验结果表明：超声振动使锯切材料过程中的比能大幅度降低；2种锯切方式下锯切比能都随着单颗磨粒最大锯切厚度的增大而降低，但普通锯切方式下锯切比能呈幂指数递减趋势，而在超声振动的作用下比能变化趋势转变为良好的线性递减；并且单晶硅材料的去除方式由普通锯切中塑性去除为主导转变为脆性断裂去除，其破碎方式属于微破碎，趋于粉末状破碎，由此在不会对工件表面产生严重损伤的同时使材料去除所消耗的能量得到了有效降低。同时，超声振动使得锯片上的磨粒对单晶硅表面的高速冲击作用，使单晶硅产生大量微裂纹，对单晶硅的微小剥离起到很大作用。因此，超声振动在单晶硅材料的加工中有着很大的发展前景。
Ultrasonic vibration can improve the properties of hard-brittle material. In order to explore the influence of ultrasonic vibration on sawing specific energy of monocrystalline silicon, experimental on sawing monicrystalline silicon was conducted with and without ultrasonic vibration assisted conditions using thin diamond blade sawing. The result shows that ultrasonic vibration can decrease sawing specific energy. With the increasing of cutting thickness of single abrasive, the specific energy always fall down, but ultrasonic vibration changes the exponentially decreasing trend of specific sawing energy in normal cutting mode into a good linear decreasing. Ultrasonic vibration changes the way the materials removal of monicrystalline silicon from plastic removal into brittle fracture and broken way become micro-broken, which reduce the energy consumption of material removal without serious damage in the surface. Ultrasonic vibration will have softening effects on monocrystalline silicon, as well as high speed impact action, which will produce large amount of microcrack of monocrystalline silicon. Thus, ultrasonic vibration has a well prospect for development in machining monocrystalline silicon.
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