采用两种不同的真空熔渗工艺制备了W80Cu20触头材料,分析了两种合金的显微组织,测定了两种合金的成分、密度、电导率、硬度和抗弯强度.对两种合金进行了真空电弧击穿试验和SF6断路器型式试验,测量其真空击穿时的截流值和击穿场强,分析了触头材料电弧烧蚀后的表面形貌,比较了两种合金的抗电弧烧蚀能力.结果表明,两步法烧骨架熔渗工艺制备的WCu合金显微组织均匀,铜相平均尺寸为4～6 μm;一步法熔渗工艺制备的WCu合金中的铜相大小不一致,存在带状铜相聚集体,其最大尺寸可达80～ 100 μm.两步法工艺制备的WCu合金的硬度、抗弯强度高于一步法制备的合金,真空击穿场强及截流值稳定,其耐电弧烧蚀能力明显高于一步法制备的合金.
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