采用以超临界CO2为物理发泡剂的固态间歇发泡技术制备了环氧树脂微孔材料,利用SEM和DSC研究了环氧树脂微孔材料的制备工艺,分析了发泡前后环氧树脂的力学性能和介电性能.结果表明:环氧树脂片材的预固化度为75％～85％时,气体浓度达到5.11％～5.43％,气体饱和时间为48 h,泡孔排列紧密尺寸均匀.发泡温度的提高和发泡时间的延长会使环氧树脂微孔材料的平均泡孔直径逐渐增大,泡孔密度逐渐降低.当环氧树脂片材预固化度为75％、发泡温度为120℃、发泡时间为10 s时,环氧树脂微孔材料的平均泡孔直径为10.6 μm,泡孔密度为1.03×109个/cm3,泡孔呈均匀致密的球形或多边形结构.与未发泡材料相比,环氧树脂微孔材料的断裂伸长率和冲击强度分别提高了43％和39％,介电常数降低了42％,介电损耗降低了50％.
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