通过放电等离子烧结(SPS)实现阻挡层 Ti-Al、过渡焊接层 Ni 与热电臂 Yb0.3Co4Sb12的一体化烧结，使用Ag-Cu-Zn 共晶合金完成热电元件 Yb0.3Co4Sb12/Ti-Al/Ni 与 Mo-Cu 电极的钎焊连接。扫描电镜(SEM)显示出Yb0.3Co4Sb12/Ti-Al/Ni/Ag-Cu-Zn/Mo-Cu 接头中各界面结合良好，无裂纹，成分分析发现 Yb0.3Co4Sb12/Ti-Al 界面存在AlCo、TiCoSb及TiSb2等金属间化合物(IMC)。500℃下等温时效30 d后， Yb0.3Co4Sb12/Ti-Al界面处的金属间化合物厚度无明显变化； Ag-Cu-Zn/Ni界面处Cu、Zn扩散趋于稳定， Cu-Zn扩散层厚度达到约40μm。界面接触电阻测试结果表明，等温时效前后Yb0.3Co4Sb12/Ti-Al/Ni/Ag-Cu-Zn/Mo-Cu元件的界面接触电阻率均低于10μ?·cm2。
The barrier layer of Ti-Al and the contact layer of Ni were joined to Yb0.3Co4Sb12 simultaneously by us-ing spark plasma sintering (SPS) technique. The Mo-Cu electrode was then welded to thermoelectric element Yb0.3Co4Sb12/Ti-Al/Ni by using Ag-Cu-Zn alloy as solder. SEM results show that there are no cracks at the inter-faces of Yb0.3Co4Sb12/Ti-Al/Ni/Ag-Cu-Zn/Mo-Cu thermoelectric joints. The EDS analysis shows that intermetallic compounds (IMCs) layer containing AlCo, TiCoSb and TiSb2 phases are formed at the interface between Yb0.3Co4Sb12 and Ti-Al. After thermal aging at 500℃ for 30 d, the inter-diffusions at both Yb0.3Co4Sb12/Ti-Al inter-face and Ag-Cu-Zn/Ni interface tend to be steady. The contact electrical resistivity of the Yb0.3Co4Sb12/ Ti-Al/Ni/Ag-Cu-Zn/Mo-Cu thermoelectric joints are about 6.1μ?·cm2after welding, and it maintained as low as 10μ?·cm2 even after thermal aged for 30 d.
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