利用磷酸二氢铝的固化反应在316不锈钢表面制备了不同含量Cu2+的磷酸铝涂层(Cu:Al=0.025、0.05、0.1).差示扫描量热分析及X射线衍射表明涂层材料可在≤250℃下固化,主要固化产物为AlH2P3O10·2H2O、AlPO4和Al8H12(P2O7)9.Cu2+加入后产生了含铜的新相Cu2P2O7.与大肠杆菌共培养12h后各含Cu2+涂层表现出抗菌性,且抗菌能力与Cu2+含量正相关;接触24 h后,所有含Cu2+涂层表面均无活菌检出.菌悬液中加入EDTA有效抑制了涂层抗菌活性,表明涂层抗菌性能来自表面溶出的Cu2+.拉伸试验表明涂层结合强度在14.5～18.1 MPa范围.与无涂层的不锈钢相比,涂覆涂层后样品的腐蚀电流密度下降了2个数量级.
Aluminum phosphate coatings containing different levels of Cu2+ ions (Cu/Al molar ratio:0.025,0.05,0.1) were prepared on 316-stainless steel based on the curing reaction of monoaluminium phosphate (MAP).The curing behaviors of the starting materials and phase compositions of the cured products were studied by differential scanning calorimetry and X-ray diffraction,respectively.Results indicate that the copper-free MAP cures at ≤250℃ to form 3 major phases:AlH2P3O10·2H2O,AlPO4,and Al8H12(P2O7)9.When Cu2+ ions are introduced into the MAP,an additional phase of Cu2P2O7 appears in the cured product.E.coli was inoculated on the surfaces of coatings to evaluate their antibacterial properties.After co-culture with E.Coli for 12 h,all Cu2+-containing coatings exhibit antibacterial effect and show a positive association between Cu2+ content and antibacterial activity.After co-culture for 24 h,no viable bacteria remain on any Cu2+-containing coating.The addition of ethylenediaminetetraacetic acid to the culture medium substantially inhibits the antibacterial activities of all coatings,confirming that the antibacterial effect is attributed to the release of Cu2+ ions from coatings.Pull-out tests show that the bonding strengths of the coatings range between 14.5-18.1 MPa.Potentiodyanmic polarization indicates that the coatings reduce the corrosion current density of the stainless steel substrate by approximately two orders of magnitude.
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