材料期刊网

目的：聚二甲基硅氧烷( PDMS)作为微流控芯片研制中常用的高分子材料，其本身的疏水特性是影响微流控芯片整体键合效果的主要障碍。为了在短时间内成功实现PDMS与基底材料的有效键合与封装，设计一种可在普通实验室开展的低成本且高效的PDMS材料改性方法。方法基于紫外臭氧光照改性法对PDMS材料表面进行改性研究，通过正交试验深入研究紫外光照射时间、距离及通氧时间对PDMS表面改性效果的影响，并在50℃水浴环境下通过测量不同时间PDMS基片与盖片( PDMS或玻璃)的键合强度，从而确定最优工艺参数组合。结果相比于传统紫外光照射表面改性法的键合时间(大于50 h)，本工艺可在6 h内成功实现PDMS的有效封装，并确定了P—P键合和P—G键合的最优参数组合，两者平均键合强度均大于200 kPa。结论整个工艺操作简单、成本低，可作为普通实验室开展微流控实验研究的有益补充。

ABSTRACT:Objective Polydimethylsiloxane ( PDMS) was developed as commonly used polymer materials in microfluidic chip, and its own hydrophobic properties was a major obstacle that affects the overall chip bonding effects. In order to achieve effective bonding and packaging between PDMS and the substrate materials within a short time, a low-cost and highly efficient PDMS materi-al modification method that could be performed in ordinary laboratories was designed. Methods Ultraviolet ozone( UVO) irradiation method was used to study PDMS surface modification, and the orthogonal experiment method was used to study the influences of UV irradiation time, distance and oxygenation time on the PDMS surface modification effects. The bond strength between PDMS sub-strate and the cover sheet ( PDMS or glass) was measured in 50 ℃ water bath at different times, and finally the optimal combina-tion of the parameters was determined. Results Compared with the traditional surface modification method of ultraviolet irradiation with a bonding time of more than 50 h, the proposed process could successfully implemented PDMS packaging within six hours. And the P—P and P—G′s optimal parameters combination was finally determined, with both average bonding strengths of greater than 200 kPa. Conclusion The whole process was simple and low-cost, and could be used as a useful supplement to microfluidic experimental research in ordinary laboratories.