以AG-70、TDE-85、ZTE-140耐高温环氧树脂为基础，使用桐油酸酐与三（2-羟乙基）异氰脲酸酯为原料合成的赛克-桐油酸酐（TTOA）为固化剂，添加活性稀释剂、环氧增韧剂、氧化铝（Al2O3）和碳化硅（SiC）填料等，制备了耐高温环氧电子灌封胶，筛选出最合适的耐高温环氧树脂体系配方。结果表明：经过配方优化后的耐高温环氧胶力学性能良好，介电性能优良，可以满足大功率IGBT模块的封装使用要求。
Using high temperature resistance epoxy resin AG-70, TDE-85, ZTE-1470 as matrix, the THEIC-tung oil anhydride (TTOA) synthesized from tung oil anhydride and tri(2-hydroxyethyl)isocyan-urate (THEIC) as curing agent, a high temperature resistance epoxy pouring sealant was prepared by add-ing reactive diluent, epoxy flexibilizer, aluminum oxide and silicon carbide fillers. The most suitable formula of high temperature resistance epoxy resin system was determined. The results show that the epoxy pouring sealant after optimizing formula has good mechanical properties and dielectrical properties, which can meet the embedment requiements of high power IGBT module.
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