以聚苯醚、氰酸酯、气相二氧化硅为原料，制备了聚苯醚/氰酸酯树脂体系，并测试了以此树脂体系制得覆铜板的力学性能、电气性能、耐溶剂性能和耐湿性能。结果表明：树脂体系中双酚A型氰酸酯树脂预聚体（CEO1PO）的质量分数约为20%时，覆铜板的综合性能最为优异；气相二氧化硅的用量占体系总质量的20%～30%时，覆铜板具有较好的力学性能和绝缘性能；最佳的固化工艺参数为150℃7 MPa/1 h+230℃8 MPa/2 h+300℃10 MPa/2 h。
A polyphenylene ether/cyanate ester resin system was prepared from polyphenylene ether, cyanate ester, and fumed silica. The mechanical properties, electrical properties, solvent resistance, and humidity resistance of the copper clad laminate made by this resin system were tested. The results show that when the mass fraction of cyanate ester in the resin system is about 20%, the copper clad laminate present the best comprehensive performance. When the mass fraction of fumed silica ranges from 20% to 30%, the copper clad laminate has good mechanical properties and insulating property. The optimum curing process is 150℃7 MPa/1 h+230℃8 MPa/2 h+300℃10 MPa/2 h.
参考文献
| [1] | 杨邦朝,崔红玲,胡永达,蒋明.高频印制电路基板[C].混合微电子技术（第十二届全国混合集成电路学术会议：论文专辑）,2001:1-7. |
| [2] | MOHAMMED A. ALAM;MICHAEL H. AZARIAN;MICHAEL G. PECHT.Embedded Capacitors in Printed Wiring Board: A Technological Review[J].Journal of Electronic Materials,20128(8):2286-2303. |
| [3] | 王结良;梁国正;赵雯;吕生华;房红强;杨洁颖.高频印刷线路板覆铜板用树脂基体的研究进展[J].中国塑料,2004(3):6-10. |
| [4] | 方庆玲;吴小龙;吴梅株;胡广群;徐杰栋.高频印制板基材发展概况和选型探讨[J].绝缘材料,2014(1):17-21. |
| [5] | 万勇军.覆铜板用热固性聚苯醚[J].热固性树脂,2001(04):25-28. |
| [6] | 王耀先;李凡;施建军;程树军.聚苯醚热固性改性及其性能研究[J].华东理工大学学报(自然科学版),2004(3):354-357. |
| [7] | Yun Jun Park;Duk Man Yu;Jeong Ho Ahn.Surface Modification of Polyimide Films by an Ethylenediamine Treatment for a Flexible Copper Clad Laminate[J].Macromolecular Research,20122(2):168-173. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%