采用微米、纳米和微纳共掺氧化铝作为填料制备了环氧树脂浇注体系，并测试其黏度和力学性能。结果表明：氧化铝粒径越小，对浇注体系的黏度影响越大，可添加量越少；当不同粒径的微米氧化铝添加量为300份时，各浇注体系的力学性能均达到最佳，但冲击强度比树脂基体明显下降；当纳米氧化铝的添加量为2.5份时，浇注体系的冲击强度相比树脂基体提升了10%；微纳共掺能够在单一组分（微米或纳米）基础上使浇注体系的力学性能进一步提高。
Micro-Al2O3, nano-Al2O3, and micro-nano co-doped Al2O3 were used to prepare epoxy resin cast-ing samples respectively, and their viscosity and mechanical properties were tested. The results show that the smaller size of Al2O3 particle has greater effect on the viscosity of the casting system. When the addi-tion amount of micro-Al2O3 with different sizes is 300 phr, the casting system has the optimum mechani-cal properties, but the impact strength decreases obviously compared to the matrix resin. When the addi-tion amount of nano-Al2O3 is 2.5 phr, the impact strength of the casting system increases by 10% com-pared to the matrix resin. The micro-nano co-doped Al2O3 can further improve the mechanical properties of the casting system compared to the single component (micro or nano Al2O3).
参考文献
| [1] | 简本成;顾滨.Al2O3作为环氧树脂浇注用填料的应用[J].轻金属,2001(8):21-23. |
| [2] | 陈允;崔博源;王宁华;刘焱;吴昱怡;程鹏.1100kV盆式绝缘子改善机械强度的研究[J].高压电器,2015(7):52-56,62. |
| [3] | 简本成;陈燕.氧化铝填料性能对环氧树脂浇注制品性能的影响[J].现代技术陶瓷,2004(1):18-20. |
| [4] | 田浩;郝留成;刘随军;袁端鹏;王海军;南传兴.GIS绝缘件用高性能环氧浇注材料的研究[J].绝缘材料,2013(3):9-13. |
| [5] | 吴海军.环氧树脂真空浇注工艺过程及注意事项[J].变压器,2000(05):33-36. |
| [6] | 费龙菲.高压开关用环氧浇注件耐热性能的研究[J].绝缘材料,2004(01):27-29. |
| [7] | J. Wolfrum;G. W. Ehrenstein;M. A. Avondet.Dynamical mechanical thermo analysis of high performance composites -- influences and problems[J].Journal of Composite Materials,200021(21):1788-1807. |
| [8] | Ratna D.;Varley R.;Raman RKS.;Simon GP..Studies on blends of epoxy-functionalized hyperbranched polymer and epoxy resin[J].Journal of Materials Science,20031(1):147-154. |
| [9] | 郑亚萍;余利波;张爱波;宁荣昌.超支化聚（胺-酯）增韧环氧树脂[J].华东理工大学学报（自然科学版）,2006(2):205-208. |
| [10] | 张斌;张会;孙明明;张旭刚;李坚辉;王磊.纳米氧化铝改性环氧树脂性能研究[J].化学与黏合,2009(5):15-17,29. |
| [11] | 王旗;李喆;尹毅;吴建东.微/纳米氧化铝/环氧树脂复合材料热导率和击穿强度的研究[J].绝缘材料,2013(2):49-52. |
| [12] | J. W. Wan;W. J. Zhang;D. J. Bergstrom.An Analytical Model for Predicting the Underfill Flow Characteristics in Flip-Chip Encapsulation[J].IEEE transactions on advanced packaging,20053(3):481-487. |
| [13] | Simon Konzelmann;Christian Hoffmann;Ralf Merte;Dirk Peier.Thermal and Electrical Properties of Aluminum Nitride Filled Epoxy-resin Compound[J].IEEE Transactions on Dielectrics and Electrical Insulation,20082(2):327-333. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%