以3,3′,4,4′-联苯四羧酸二酐（BPDA）、1,3-双(4-氨基苯氧基)苯（TPER）、3,4′-二氨基二苯醚（3,4′-ODA）、邻苯二甲酸酐（PA）为原料制备了一种共聚封端热塑性聚酰亚胺（TPI）薄膜，采用DSC、TG、万能拉伸试验机、DMA等对其性能进行测试和分析。结果表明：共聚封端TPI薄膜的加工性能提高，同时保持了较高的热稳定性和较好的拉伸性能。其中加入3%PA封端剂制备的树脂综合性能最好，具有较低的熔点（328.8℃）、结晶温度（311.6℃）、损耗模量（4.1×108 Pa）和较高的玻璃化转变温度（210.1℃），采用该树脂制备的TPI薄膜综合性能最佳。
A copolymerized and terminated thermoplastic polyimide film (TPI) was prepared from 3,3′,4, 4′-biphenyltetracarboxylic dianhydride (BPDA), 1,3-bis(4-aminophenoxy)benzene (TPER), 3,4′-diaminodiphe-nyl ether (3,4′-ODA), and phthalic anhydride (PA), and its performance was tested and studied by DSC, TG, universal tensile testing machine, and DMA. The results show that the TPI has better processability and keeps high thermal stability and good tensile properties. The TPI prepared with 3% PA has the best comprehensive performance, with 328.8℃ of melting point, 311.6℃ of crystallization temperature, 4.1 × 108 Pa of loss modulus, and 210.1℃ of glass transition temperature. The film prepared by the TPI has optimum comprehensive performance.
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