通过腰果酚与苯酚的加成反应合成了一种新型的酚醛树脂,制备了一种XPC纸基覆铜板,并研究了原料配比和制备工艺对覆铜板性能的影响,测试了其耐浸焊性、吸水率和体积电阻率等性能.结果表明:采用优化原料配比和工艺制备的纸基覆铜板,其耐浸焊性为25~30 s(260℃),吸水率低于1.3%,且具有优良的电绝缘性能和耐热性能.
A novel phenolic resin was synthsized from cashew phenol and phenol by addition reaction, and a XPC paper-based copper clad laminate (CCL) was prepared from the phenolic resin. The effect of ratio of raw materials and preparation process on the properties of the CCL was studied, and the solder resistance, water absorption, and volume resistivity of the CCL were tested. The results show that the CCL prepared by optimum ratio of raw materials and preparation process has excellent electrical proper-ties and heat resistance, the solder resistance at 260 ℃ is 25~30 s, and the water absorption is lower than 1.3%.
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