采用化学镀手段制备金属镍包覆的超高分子量聚乙烯复合粒子,通过热压成型方法制得具有隔离结构的超高分子量聚乙烯(UHMWPE)/镍(Ni)高导电复合材料.通过调节金属(镍)镀层厚度及加工温度考察不同Ni含量及加工温度对复合材料导电性能的影响.结果表明,复合材料具有明显的导电逾渗行为;通过化学镀工艺可有效提高金属填料与基体的结合力,同时实现金属镍在聚合物基体中的选择性稳定分布,构建具有隔离结构的导电网络,使得复合材料的逾渗值降低至1.02％(体积分数).基于金属填料优异的导电性能,在Ni体积分数仅为2.53％时,复合材料的电导率达到2648 S/m.此外,降低复合材料的加工成型温度有助于减少加工过程对导电网络的破坏作用,从而有效降低复合材料的导电逾渗值,对提高复合材料导电性能具有重要意义.
Ultra high molecular weight polyethylene(UHMWPE)/nickel(Ni)conductive particles were fabricated via electroless plating,and then the conductive composites with segregated structure were fabricated via hot compressior.The influence of processing temperature and Ni contents on the conductivity of composites was investigated.The composites show the typical percolation behavior.Electroless plating method can effectively improve the adhesion strength of the metal filler and matrix,and realize selective and stable distribution of nickel in the polymer matrix.The electrical percolation threshold of the conductive composite is as low as 1.02 ％ due to the construction of conductive networlk with segregated structure.The electrical conductivity of the conductive composite reaches up to 2648 S/m,which can be attributed to the metallic fillers with superior inherent electrical conductivity.Besides,decreasing the processing temperature can reduce the damage of conductive network.It is important to improve the electrical conductivity and reduce the percolation threshold of composites.
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