研究电铸镍层的微观结构和表面氧化膜的形成、硫酸酸蚀去除氧化膜的过程及其对非连续电铸后镍层结合致密度的影响.利用X射线衍射仪(XRD)和扫描电镜(SEM)对电铸镍层的微观结构进行表征,利用能谱仪(EDS)和高精度电子天平研究镍层表面氧元素含量,采用扫描电镜观测二次电铸后镍层间结合致密度.结果表明:电铸镍层具有明显的(100)晶面择优取向,120 min后,镍层表面基本氧化完全;氧化膜随着硫酸酸蚀时间的增加而不断损失,10%质量分数的硫酸酸蚀60 min可以除去氧化完全的镍层表面的氧化膜,非连续电铸所得双层镍层之间结合致密.
The formation of oxide film on the nickel surface and the effect of sulfuric acid erosion on the remain of the oxide film and the binding densification between two electroformed nickel layers were investigated. The microstructure of electroformed nickel layer was characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). The oxygen content on the surface of the nickel layer was characterized by energy dispersive spectroscopy (EDS) and high precision electronic scale, the binding density between two electroformed nickel layers was observed by SEM. The results show that the electroformed nickel crystal orientation prefers (100), the electroformed nickel is substantially oxidized after 120 min. The oxide film decreases with the increase of the etching time, and disappears completely after etched in 10% (mass fraction) sulfuric acid for 60 min, and the two nickel layers combine densely.
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