研究了连接过程中通过原位形成金属间化合物来提高Si3N4陶瓷接头高温性能的可能性.研究了用Ti/Ni/Ti多层中间层在1000-1150℃温度范围内以过渡液相连接Si3N4陶瓷时Ti和Ni层厚度、连接时施加的压力以及连接温度与保温时间等因素对接头组织和强度(包括室温和高温强度)的影响规律.结果表明,在合理控制连接工艺和中间层金属厚度的条件下,可以通过原位形成金属间化合物获得室温和高温强度均较好的接头,800℃时接头的剪切强度可保持88 MPa左右.
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