通过建立可靠性分析的力学模型,对温度循环载荷下通孔焊点内部应力应变场的分布特征进行了有限元数值模拟.结果表明,焊接方式的不同造成焊点形态的差异,进而应力应变的分布也不同;再流焊点的应力应变集中在钎料体及镀铜管处,而波峰焊点中线路板与镀铜层接触的拐角处是高应力集中区,这些位置容易引起裂纹产生和扩展.在热载荷过程中,应力-应变场的等值分布呈现出与温度历史相关的动态特性.
参考文献
| [1] | Robertson R G, Nguyen N. Circ Assem, 1998; 9(11): 32 |
| [2] | Johnson Z, Eyman M. Thermomechanical Phenomena in Electronic System-Proceedings of the Intersocietiy Conf,Washington, IEEE, Piscataway, 1998:82 |
| [3] | Mui G K, Wu X H, Hu K X, Yeh Chao-Pin, Wyatt K, Steger J. Proceedings Electronic Components and Technology Conf, San Jose California, IEEE, Piscataway, 1997:436 |
| [4] | Shin Y E, Lee K W, Chang K H, Jung S B, Jung J P.Mater Trans, 2001; 42:809 |
| [5] | Lall P, Banerji K. Microelectron Reliab, 2000; 40:1081 |
| [6] | Lau J H, Harkins C C. IEEE Trans CHMT, 1988; 11:380 |
| [7] | Jung W, Lau J H, Pao Y H. ASME J Electron Packag,1997; 119(3): 163 |
| [8] | Ling S, Dasgupta A. ASME J Electron Packag, 1996;118(2): 72 |
| [9] | Amagai M. Microelectron Reliab, 1999; 39:463 |
| [10] | Yao Q Z, Qu J M, Wu S X. Proceedings-Electronic Components and Technology Conf, San Diego, 1999:797 |
| [11] | Zhao X J, Wang C Q, Wang G Z, Zheng G Q, Yang S Q.IEEE Trans Elect Pack Manu, 2000; 23(2): 87 |
| [12] | Wu X H, Hu K, Dou X Y, Mui G, Yeh Chao-pin, Wyatt K.In: Hausen D M, Petruk W, Hagni R D eds, TMS Annual Meeting, Orlando Florida, Minerals, Metals & Material Soc, 1997; 2:179 |
| [13] | Brakke K A. Surface Evolver Manual. Version 2.01.Susquehanna University, 1996 |
| [14] | Wong B, Helling D E, Clark R W. IEEE Trans CHMT,1988; 11:284 |
| [15] | Hong B Z, Burrell L G. IEEE Trans CPMT, 1997; 20:280 |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%