2219Al-Cu合金进行脉冲MIG焊时,加入电磁搅拌可降低焊缝处固-液界面前沿液相的温度梯度,增加非均质形核率,促使粗大、方向性很强的柱状晶转变为细小的等轴晶;沿晶界和枝晶间分布的α(Al)-CuAl2共晶均匀化;提高了焊缝中Cu元素分布均匀性,形成高密度的GP区,促进θ′相非均质形核.电磁搅拌使接头抗拉强度由296.4 MPa增加到326.0 MPa,接头系数由63%上升到70%,延伸率由4.7%增加到7.6%.
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