本文采用直接敷铜工艺，1070°C流动氮气氛下保温3h制得剥离强度达11.5Kg/cm2的直接敷铜Al2O3基板.界面产物CuAlO2的形成是获得较高结合强度的关键.敷接温度下，在界面上产生了能很好润湿Al2O3表面的Cu［O］共晶液体，并反应生成了连续的CuAlO2层.降温时,共晶液体从Cu侧开始固化并淀析出Cu2O颗粒.当固化前沿与CuAlO2层相遇时，液相参与的界面反应停止.冷却至室温，即可获得Cu和Al2O3基板之间的牢固结合.
Cu-Cu2O eutectic bonding of copper to Al2O3 was investigated. The highest peel strength was 11.5kg/cm for the specimen prepared at 1070C for 3h in nitrogen atmosphere. Oxygen promoted the wetting between copper and Al2O3 greatly. Cu［O］ melt reacted with the alumina and formed 奱 continuous CuAlO2 layer, which enhanced the peel strength of the joint. On cooling, the solidification front moved from the solid copper towards alumina, and Cu2O precipitated from the Cu［O］ melt. When the solidification front met the CuAlO2 layer, liquid-aided reaction completed and a reliable bond was achieved between the copper and Al2O3 substrate
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