热挤压法成型的卤化银多晶光纤，经不同温度热处理后，光纤的显微结构发生了变化. 扫描电镜形貌分析结果显示，热处理温度T170C，显微结构未发生变化，晶粒尺寸12. T=200C时，晶粒尺寸1020；T=250C时，晶粒尺寸2030；T=300C时，晶粒尺寸3040. 光纤显微硬度测量结果也显示，热处理温度>170C后，光纤的显微硬度随热处理温度的升高而降低，在200C?附近硬度降至最低值.
The silver halide fibers were made by hot extrusion. The microstructure of the fibers changed after thermal treatment at different temperatures. SEM micrographs showed that the microstructure of the fibers did not change when temperatures of thermal treatment T<170C, and their grain sizes were 12. The grain size grew up when T>170C. The relation of grain size and T was as follows: 1020, T=200C; 2030, T=250C; 3040, T=300C, respectively. The measurements of microhardness also showed that the microhardness of the fibers decreased as temperatures of thermal treatment increased when T>170C and the lowest microhardness appeared at 200C
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