直接敷铜Al2O3基板已被广泛应用于大功率场合. 本文通过Cu箔表面预氧化生成Cu2O的方法引入氧, 1070C在Cu箔和Al2O3基板界面上所产生的Cu-Cu2O共晶液体促进了二者的牢固结合. 流动氮气氛下保温1h, 观察到了明显的界面产物层. SEM和XRD的分析表明, 界面产物相为CuAlO2.
Direct copper-bonded alumina substrates were widely usedin large-power applications. Cu-Cu2O eutectic bonding of copper to Al2O3was investigated in this paper. Oxygen was introduced by pre-oxidizing copper foil andit was shown that Cu-Cu2O eutectic liquid promoted the bonding between copperand Al2O3 greatly. Chemical reaction happened at the solid-liquid interface andled to the formation of the binary oxide CuAlO2, which can be observed whenthe specimen was prepared at 1070C for 60min.
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