介电常数K高于7200的、具有满足X7R( -55～125℃，±15％)规范要求的低烧复合多层陶瓷电容器(CMLCCs)已经研制成功．该电容器是由四种具有不同介温特性的PMN-PNN-PT和PMN-PT体系的瓷介质膜片按一定布局复合构成．其内部显微结构良好．本研究表明，采用不同材料共烧以得到具有优良性能的片式元件是可行的．
The low-sintering composite multilayer ceramic capacitors (CMLCCs) having K-value higher than 7200 with X7R characteristics (-55～+125℃, +15%) were successfully developed. The CMLCCs incorporate four PMN-PNN-PT or PMN-PT based ceramics with different Curie temperature as the principal components. The green tapes are stacked according to a certain order and cofired. The CMLCCs have good microstructures. The research results show that it is feasible to produce chip components with high performance by cofiring multi-phases materials.
参考文献
| [1] | Electronic Industries Association, EIA RS-198C (1983). |
| [2] | Steve Butcher, Mike Chu, Alan Rae. TAM Ceramics Inc., Ceramic Industry, 1997, 12: 29-30. |
| [3] | Swartz S L, Shrout T R. Mater. Res. Bull., 1982, 17: 1245-1250. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%