采用热挤压法成型制备出卤化银多晶光纤。光纤端面扫描电镜形貌分析结果显示，挤压温度120～210℃，晶粒大小基本不变，晶粒尺寸1～2μm。挤压温度＞210℃后，随着挤压温度升高挤压压力降低，在250℃时晶粒尺寸5～10μm，挤压温度的升高导致卤化银多晶光纤的晶粒长大，引起光纤散射损耗的增高。挤压模具中加入润滑剂可同时降低挤压压力和挤压温度，但引起光纤传输损耗的增加。
The silver halide fibers were made by means of hot extrusion. SEM micrographs show that the grain sizes of the fibers do not change when temperature of hot extrusion T＝120～210℃and grain size 1～2μm. The pressure is decreased as the temperature increases when T ＞210℃,The grain size is 5～10μm at 250℃. The growth of grains results in scattering loss increment. The temperature and pressure are decreased when the model is smeared with lubricant, but the lubricant results in loss increment.
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