对p型Bi2Te3温差电材料的电沉积过程进行了研究,分析了添加剂对电沉积过程的影响.在此基础上,以孔径为50nm的阳极氧化铝多孔膜为模板,采用直流电沉积技术,在氧化铝多孔模板的纳米级微孔内电化学组装出了p型Bi2Te3纳米线阵列温差电材料.性能研究表明,p型Bi2Te3纳米线阵列的温差电性能远远超过具有相同组成的块状温差电材料.
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