采用传统的电子陶瓷制备工艺制备了BSTO/Mg2SiO4/MgO复合材料,并对样品的结构及其介电性能进行了表征与分析,讨论了Mg2SiO4/MgO掺杂对BSTO/Mg2SiO4/MgO复合材料结构和性能的影响.结果表明,与前其他掺杂改性的BSTO复合材料相比,BSTO/Mg2SiO4/MgO复合材料不仅可以在较低的温度烧结致密,而且在介电常数降低的同时,仍能保持较高的可调性,如BSTO/39wt%Mg2SiO4/17wt%MgO的介电常数εr为~80.21,在2kV/mm的直流偏置电场下,其可调性达到~12%,介电损耗为~0.003.
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