选用β-Si3N4粉体代替传统的SiO2填料与环氧树脂复合,制备新型高导热电子模塑料.初步研究了单独添加β-Si3N4及与SiO2复合添加对复合材料导热性能的影响.结果表明:β-Si3N4粉体可以显著提高复合材料的导热性能,当填充率达到50vol%时,β-Si3N4填充复合材料热导为SiO2填充复合材料的约3.8倍.并在实验基础上,探讨了复合材料的热导率计算模型,给出了单一填充和复合填充复合材料的Agari热导率计算模型表达式及相关参数.
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