薄膜/基底结构是微电子学和材料科学中广泛应用的典型结构.由于加工工艺中材料力学、热学性能失配等原因导致的薄膜中出现的残余应力,是界面裂纹的萌生和扩展的重要原因.采用三参数(Γ0,/σy,t)的修正的断裂过程区结合力模型,讨论了在塑性氛围下裂尖解理断裂的过程,裂尖应力分布,裂尖形貌和表征裂纹尖端断裂过程区特征参数对断裂过程的影响,并应用到均质金属薄膜/陶瓷基底结构中残余应力导致界面裂纹起裂和扩展的全过程分析中.
参考文献
| [1] | Liplin D M, Clarke D R, Beltz G E. A strain-gradient model of cleavage fracture in plastically deforming materials [J]. Acta Materialia, 1996,44: 4051-4058. |
| [2] | Tvergaard V, Hutchinson J W. The relation between crack growth resistance and fracture process parameters in elastic-plastic solids [J]. J Mech Phys Solids, 1992,40: 1377-1397. |
| [3] | Tvergaard V, Hutchinson J W. The influence of plasticity on mixed mode interface toughness [J]. J Mech Phys Solids, 1993,41: 1119-1135. |
| [4] | Elssner G, Korn D, Ruhle M. The influence of interface impurities on fracture energy of UHV diffusion bonded metal-ceramic bicrystals [J]. Scripta Metall Mater, 1994,42: 1037-1042. |
| [5] | Hutchinson J W. Linking scales in fracture mechanics [A]. In: Karihaloo B, et al, eds. Advances in Fracture Research ICF9, Vol 1 [M]. Sydney:Pergarmon Press, 1997. 1-14. |
| [6] | Suo Z, Shih C F, Varias A G. A theory for cleavage cracking in the presence of plastic flow [J]. Acta Metall Mater, 1994,41: 1551-1557. |
| [7] | Tvergaard V. Cleavage crack-growth resistance due to plastic-flow around a near-tip dislocation-free region [J]. J Mech Phys Solids, 1997, 45(6): 1007-1023. |
| [8] | Wei Y, Hutchinson J W. Nonlinear delamination mechanics for thin films [J]. J Mech Phys Solids, 1997, 45(7): 1137-1159. |
| [9] | Wei Y, Hutchinson J W. Steady-state crack growth and work of fracture for solids characterized by strain gradient plasticity [J]. J Mech Phys Solids, 1997,45: 1253-1273. |
| [10] | Wei Y, Hutchinson J W. Models of interface separation accompanied by plastic dissipation at multiple scales [J]. Inter J Fracture, 1999,95: 1-17. |
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