选用粒径为20um和60 μm的SiC颗粒,采用挤压铸造方法制备了基体分别为工业纯铝L2、LD11(Al-12%Si)和AlSi20(Al-(18～21)%Si)的复合材料,研究了材料的导热性能.在等比表面积的基础上,提出了等效颗粒直径的概念,解决了两种粒径颗粒混合增强铝基复合材料导热率的预测问题.结果表明,SiCP/Al复合材料具有较为优异的导热率,且LD11基与AlSi20基复合材料的导热率大于基体合金的导热率,这与颗粒的等效直径大于临界粒径且颗粒导热率大于基体导热率有关;但复合材料的导热率随着基体中Si含量的增加而降低.
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