采用多元耦合物理场CVI工艺,用炭毡作为增强体,在增强体中设计导电层,产生温度场和电磁场梯度,在自行设计的CVI炉中增密C/C复合材料,对温度、系统压力和气体流量等工艺进行了优化;采用偏光显微镜研究了热解炭的显微结构;用X射线衍射研究了材料的石墨化度;探讨了本工艺中的有内热源和无内热源的二元传热机制,多元耦合物理场的有机耦合对"消耗传质"的抑制作用,以及电磁场对沉积的影响和3种典型的生长模型.研究表明,多元耦合物理场CVI增密速度快,初始密度为0.2 g/cm3,尺寸为260 mm×60 mm×20 mm的增强体,在920℃、4kPa条件下沉积20 h,试样可增密到1.71 g/cm3;可获得粗糙层结构(RL)、光滑层结构(SL)、带状结构(Banded structure)等热解炭的结构,在960℃、0.1kPa条件下可获得较高织构的粗糙层结构.
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