研究了低分子量聚碳硅烷(PCS)通过先驱体浸渍裂解(PIP)工艺制备Cf/SiC复合材料.分析表明:PCS的数均分子量为400,活性较强,陶瓷化产率为70%左右,在1200℃基本转化为微晶态的β-SiC.分别通过3种不同升温速率制备了3D-Cf/SiC复合材料试样,其弯曲强度分别为745.2 MPa、686.7 MPa和762.5 MPa,明显高于文献报道3D-Cf/SiC复合材料弯曲强度300～500 MPa的水平.试样断口的SEM照片均显示长的纤维拔出,有良好的增韧效果,低分子量PCS裂解得到的基体比较致密.实验结果说明,低分子量PCS适合于制备3D-Cf/SiC复合材料,并且提高升温裂解速率对材料性能影响很小.
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