采用注射成型方法制备了SiCP封装盒体的预成型坯,用压力浸渗方法将熔融铝浸渗到SiCP封装盒体的预成型坯中,制备出含SiCP体积分数为65%的SiCP/Al复合材料的封装盒体.SEM观察表明,经过压力浸渗后SiCP/Al复合材料组织均匀且致密化高,室温热膨胀系数为8.0×10-6/K,热导率接近130 W/(m·K),密度为2.98g/cm3,能够很好地满足电子封装的要求.
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