复合材料Z-pinning增强技术通过在层合板内嵌入体分比小于5%的Z-pins,能大幅度提高层合板的层间断裂韧性,减少因低能量冲击所产生的分层损伤.本文作者基于细观力学模型,构造了相应的Z-pin单元;结合梁单元,建立了用于分析含Z-pins的双悬臂梁(Double cantilever beam,DCB)的有限元模型;在分层裂纹面上引入接触单元以防止分析过程中2个分层子梁在分层前缘处的相互嵌入.通过数值算例分析了Z-pins对层间韧性增强效果的影响及其原因.数值计算结果表明,Z-pins的几何分布对其增强层间韧性的影响相对较小.
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